Abstract:Electronic systems that offer elastic mechanical responses to high strain deformations are of growing interest, due to their ability to enable new electrical, optical and biomedical devices and other applications whose requirements are impossible to satisfy with conventional wafer-based technologies or even with those that offer simple bendability. This paper describes materials and mechanical design strategies for classes of electronic circuits that offer extremely high flexibility and stretchability over large area, enabling them to accommodate even demanding deformation modes, such as twisting and linear stretching to ‘rubber-band’ levels of strain over 100%. The use of printed single crystalline silicon nanomaterials for the semiconductor provides performance in flexible and stretchable complementary metal-oxide-semiconductor (CMOS) integrated circuits approaching that of conventional devices with comparable feature sizes formed on silicon wafers. Comprehensive theoretical studies of the mechanics reveal the way in which the structural designs enable these extreme mechanical properties without fracturing the intrinsically brittle active materials or even inducing significant changes in their electrical properties. The results, as demonstrated through electrical measurements of arrays of transistors, CMOS inverters, ring oscillators and differential amplifiers, suggest a valuable route to high performance stretchable electronics that can be integrated with nearly arbitrary substrates. We show examples ranging from plastic and rubber, to vinyl, leather and paper, with capability for large area coverage.

Collapse of Liquid-Overfilled Strain-Isolation Substrates in Wearable Electronics

Soft Elastomers with Ionic Liquid‐Filled Cavities As Strain Isolating Substrates for Wearable Electronics

Collapse of arbitrary-shaped soft microfluidics

Design of Strain-Limiting Substrate Materials for Stretchable and Flexible Electronics

Collapse of Microfluidic Channels/Reservoirs in Thin, Soft Epidermal Devices

Flexible Electronics: Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper (adv. Mater. 36/2009)

Soft Elastomers with Programmable Stiffness As Strain-Isolating Substrates for Stretchable Electronics.

A Strain-Isolation Design for Stretchable Electronics

Stretchability of Encapsulated Electronics

Optimized Structural Designs for Stretchable Silicon Integrated Circuits

An analytical mechanics model for the island-bridge structure of stretchable electronics

Anti-self-collapse Design of Reservoir in Flexible Epidermal Microfluidic Device Via Pillar Supporting

Finite Deformation Mechanics In Buckled Thin Films On Compliant Supports

Ultrathin Silicon Circuits with Strain‐Isolation Layers and Mesh Layouts for High‐Performance Electronics on Fabric, Vinyl, Leather, and Paper

Elastomers with Microislands as Strain Isolating Substrates for Stretchable Electronics

Failure Mechanism of Underfill Fillet Cracks in Flexible Wearable Electronics

Stretchable, Curvilinear Electronics Based on Inorganic Materials

Chemical Sensing Systems That Utilize Soft Electronics on Thin Elastomeric Substrates with Open Cellular Designs.

Stretchable silicon electronics and their integration with rubber, plastic, paper, vinyl, leather and fabric substrates

Design strategy of porous elastomer substrate and encapsulation for inorganic stretchable electronics

Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.