Microstructures, Mechanical Properties and Electromagnetic Wave Absorption Performance of Porous SiC Ceramics by Direct Foaming Combined with Direct-Ink-Writing-Based 3D Printing
Jianqin Wu,Lu Zhang,Wenqing Wang,Ruyue Su,Xiong Gao,Suwen Li,Gang Wang,Rujie He
DOI: https://doi.org/10.3390/ma16072861
IF: 3.4
2023-04-04
Materials
Abstract:Direct-ink-writing (DIW)-based 3D-printing technology combined with the direct-foaming method provides a new strategy for the fabrication of porous materials. We herein report a novel method of preparing porous SiC ceramics using the DIW process and investigate their mechanical and wave absorption properties. We investigated the effects of nozzle diameter on the macroscopic shape and microstructure of the DIW SiC green bodies. Subsequently, the influences of the sintering temperature on the mechanical properties and electromagnetic (EM) wave absorption performance of the final porous SiC-sintered ceramics were also studied. The results showed that the nozzle diameter played an important role in maintaining the structure of the SiC green part. The printed products contained large amounts of closed pores with diameters of approximately 100–200 μm. As the sintering temperature increased, the porosity of porous SiC-sintered ceramics decreased while the compressive strength increased. The maximum open porosity and compressive strength were 65.4% and 7.9 MPa, respectively. The minimum reflection loss (RL) was −48.9 dB, and the maximum effective absorption bandwidth (EAB) value was 3.7 GHz. Notably, porous SiC ceramics after sintering at 1650 °C could meet the application requirements with a compressive strength of 7.9 MPa, a minimum RL of −27.1 dB, and an EAB value of 3.4 GHz. This study demonstrated the potential of direct foaming combined with DIW-based 3D printing to prepare porous SiC ceramics for high strength and excellent EM wave absorption applications.
materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,metallurgy & metallurgical engineering