Processing of PZT Microstructures

SN Wang,JF Li,XH Li,M Esashi

IF: 1.2

1998-01-01

Sensors and Materials

Abstract:Lead zirconate titanate (PZT) ceramic microstructures have been obtained by two reciprocal approaches, both of which are batch-fabrication-oriented. One approach starts from PZT powders using a lost Si mold technique, where a Si mold is prepared by deep reactive ion etching (RIE) and sintering of PZT after slurry casting is performed by glass-encapsulated hot isostatic pressing (HIP). The Si mold is finally etched away selectively by XeF 2 . The resulting PZT structures are of high density and accurately reflect the complementary shapes of the Si molds. The highest aspect ratio is over 15. Fine PZT rod arrays for ultrasonic microtransducers and parallel plates for stacked piezoelectric microactuators have been achieved. The finest rods are 7 μm square in cross section, 90 μm in height and 1 2 μm in period; the 25-μm-pitch PZT plates are 18 μm thick and 130 μm high. The other approach is to fabricate bulk PZT substrates into microstructures by deep RIE using SF 6 gas with electroplated Ni films as protective masks. The etch depth is 70 μm and the etch rate is 0.3 μm/min.