Influences of Vacuum Annealing on Properties of Silicon Nitride Films Prepared by Low-frequeny PECVD Technology

柳聪,蒋亚东,黎威志
DOI: https://doi.org/10.16818/j.issn1001-5868.2012.01.018
2012-01-01
Abstract:Influences of vacuum annealing on properties of silicon nitride films prepared with different gas flow ratios by plasma enhance chemical vapor deposition(PECVD) were studied.Film thickness,refractive index(RI) and the etching rate in HF were measured,respectively.Results show that,the thickness and RI of annealed silicon nitride films were related to gas flow ratios,whilst the etching rate in HF decreased rapidly with the increase of annealing temperature.In addition,Fourier transform infrared spectrometry(FTIR) was employed to investigate the origin of above measurement results.
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