Abstract:Fermi-level pinning (FLP) effect was widely observed in thin-film transistors (TFTs) with van der Waals (vdW) layered semiconductors (organic or two-dimensional) when contact electrodes were thermally evaporated1-3. Intensive investigation was implemented for formation of FLP-free interfacial states by eliminating chemical disorder and crystal defects arising from metal deposition4-9. However, technical and principal challenges are still existing towards high-yield, wafer-scalable and low-cost integration of TFT devices. Herein, we developed a general, scaling-up strategy to fabricate large-scale, high-performance FLP-free organic TFT (OTFT) arrays by using printed vdW contacts consisting of MXene composite electrodes and 2, 7-dioctyl [1] benzothieno [3, 2-b] [1] benzothiophene (C8BTBT). Room-temperature processes allow for a physically stacked junction without any structural or chemical damages. The OTFT arrays can be printed on a large-area silicon wafer or plastic film with 100% yield, exhibit ultrahigh field-effect mobility ({\mu}_FE) over 17.0 square centimetres per volt per second (cm2 V-1s-1), high on/off ratio exceeding 108, relatively low contact resistance of 3k ohm micrometres. The underlying mechanism for the high device performance was unveiled by Kelvin Probe Force Microscopy (KPFM) combined with theoretical simulation. The results indicate that work function (W_F) of the printed electrodes can be tuned at a wide range of 4.8-5.6 eV, thus significantly lowering the charge-injection barrier at the contact interfaces with ideal FLP-free character (the interfacial factor reaches 0.99 \pm 0.02). This study paves a general strategy for achieving large-scale, high-performance thin-film electronics.

Design Methodology for TFT-Based Pseudo-CMOS Logic Array with Multilayer Interconnection Architecture and Optimization Algorithms

Design Methodology for Thin-Film Transistor Based Pseudo-CMOS Logic Array with Multi-Layer Interconnect Architecture.

Mechanical Strain and Temperature Aware Design Methodology for Thin-Film Transistor Based Pseudo-Cmos Logic Array.

Mechanical Strain and Temperature Optimization for Thin-Film Transistor Based Pseudo-CMOS Logic Array

A Fast OPC Algorithm for IC Layout Based on 1-D Cells after Optimization of Gap Distribution

Physical design optimization of MOSFETs for millimeter wave and sub-millimeter wave circuits

Flexible Circuits and Systems for Smart Biomedical Applications

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P‐1.15: TFT‐based Addressing and Readout Circuits for Hybrid LAE‐CMOS Interfacing

High-Yield, Scaling-Up Fabrication of Fermi-Level-Pinning-Free Organic Thin-Film Transistor Arrays with Printed Van der Waals Contacts

Precise Patterning of Large‐Scale TFT Arrays Based on Solution‐Processed Oxide Semiconductors: A Comparative Study of Additive and Subtractive Approaches

CMOS backend-of-line compatible memory array and logic circuitries enabled by high performance atomic layer deposited ZnO thin-film transistor

Strengthened Complementary Metal-Oxide-Semiconductor Logic for Small-Band-Gap Semiconductor-Based High-Performance and Low-Power Application

P‐17: Design of AMOLED Pixel Circuit Using LTPO TFTs with Enhanced Reliability

Ultra-Low-Power and Performance-Improved Logic Circuit Using Hybrid TFET-MOSFET Standard Cells Topologies and Optimized Digital Front-End Process

Optimized Optical Design of Thin-Film Transistor Arrays for High Transmittance and Excellent Chromaticity

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Logic Computing Field-Effect Transistors Based on a Monolayer WSe2 Homojunction for the Semi-adder and Decoder

Design and optimization of CMOS layout structure for improved semiconductor device performance

Three-Dimensional Flexible Complementary Metal-Oxide-Semiconductor Logic Circuits Based on Two-Layer Stacks of Single-Walled Carbon Nanotube Networks.