Abstract:Although the researches in effects of tool geometry on the removal behavior of many metals have been studied, the deformation and removal mechanisms of tungsten have changed greatly due to the higher brittleness of tungsten compared with other metals and the research on the removal behavior of tungsten involved changing of tool geometry during nano-cutting has not been reported, which limits the development of high precision manufacturing of tungsten components. Herein, molecular dynamics (MD) simulation model of nano-cutting tungsten was established, and the material removal behavior induced by changing of tool geometry was comprehensively studied. The results showed that a larger positive rake angle or larger clearance angle or smaller edge radius of the tool was beneficial to reduce the surface roughness, elastic recovery, thickness of subsurface damage layer, cutting force, cutting temperature, friction coefficient, and maximum stress while the surface presented less residual compressive stress or even tensile stress. In the plastic deformation dominated by phase transition and dislocation slip, the region of 1/2 dislocation line presented compressive stress state whereas the region of dislocation line presented tensile stress state during nano-cutting tungsten. Meanwhile, there was no phase transition from BCC structure to other crystal structures, but rather from ordered structure to disordered structure (amorphous structure). The correlation between amorphous phase transition and dislocation slip was affected by the tool geometry owing to the fact that the temperature and stress were different under different tool geometries. The research findings provide a comprehensive theoretical basis for the micro removal behavior of tungsten and technical reference for the design of tools in nano-cutting.

Effect of cutting tool geometries on the ductile-brittle transition of monocrystalline sapphire

Numerical Investigation of the Evolution of Grit Fracture and Its Impact on Cutting Performance in Single Grit Grinding

Effect of Tool Rake Angle and Crystal Orientation on Ductile Mode Cutting of Hard/Brittle Materials

A Machining Science Approach to Dental Cutting of Glass Ceramics Using an Electric Handpiece and Diamond Burs

Cutting characteristics of dental glass ceramics during in vitro dental abrasive adjusting using a high-speed electric handpiece

Wear Behaviors of Pcd Tools in Turning Granite

Effects of vibration trajectory on ductile-to-brittle transition in vibration cutting of single crystal silicon using a non-resonant tool

Influence of crystallographic effect on tool wear, cutting stress, cutting temperature, cutting force and subsurface damage in nano cutting of single crystal silicon carbide

Anisotropic cutting mechanisms on the surface quality in ultra-precision machining of R-plane sapphire

Cutting depth-oriented surface morphology control in diamond-turning brittle single-crystal germanium

Effect of tool rake angle on the material removal mechanism transition of single-crystal silicon: a molecular dynamics study

Coupled effect of tool geometry and tool-particle position on diamond cutting of SiCp/Al

Influence of sintering temperature on dicing performances of metal-bonded diamond blades on sapphire

Effect of Cutting Edge Radius on Surface Roughness in Diamond Tool Turning of Transparent MgAl2O4 Spinel Ceramic

Effects of tool geometry on tungsten removal behavior during nano-cutting

Atomistic origin of brittle-to-ductile transition behavior of polycrystalline 3C–SiC in diamond cutting

Wear evolution of metal bond diamond tool in grinding of sapphire

An analytical force and energy model for ductile-brittle transition in ultra-precision grinding of brittle materials

An experimental and numerical investigation on rock cutting behavior of specially-shaped PDC cutter

Brittle–ductile Transition in the Diamond Cutting of Glasses with the Aid of Ultrasonic Vibration

Friction and cutting characteristics of micro-textured diamond tools fabricated with femtosecond laser