An improved yield model for embedded flash

Yun Xu,Yuxiang Zhang
DOI: https://doi.org/10.1109/CSTIC.2018.8369180
2018-01-01
Abstract:The product yield of IC fabrication (FAB) comes from the two contributions of Yline (Line Yield) and Yw (Wafer Yield), in which Yw is determined by Ys*Yr. Yr is generally shown as a random distribution of failure. We can use the Yr of the existing products to get the D0 that represents the control level of the process particle/defect through a Yr-D0 model. The applicability and accuracy of the Yr-D0 model is the key to yield prediction and FAB line particle improvement. This paper first introduces several commonly used yield models (Yr-D0), mainly describes an improved yield model in practical applications, and finally gives the effect of this model.
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