Improved Creep Resistance of Al-Cu Alloy Matrix Composite Reinforced with Bimodal-Sized TiCp

Wei-Si Tian,Qing-Long Zhao,Run Geng,Feng Qiu,Qi-Chuan Jiang
DOI: https://doi.org/10.1016/j.msea.2017.12.071
IF: 6.044
2017-01-01
Materials Science and Engineering A
Abstract:The creep resistance of the bimodal-sized (micron+nano) TiCp/Al-Cu composite was 10–38 times and 3–6 times higher than that of the Al-Cu matrix alloy and monomodal-sized composites, respectively, attributed to strengthening effects of nano-TiCp and larger number of finer θ′ precipitates.
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