Total Ionizing Dose Effect and Radiation Hardness Analysis on Low-Leakage ESD Devices Fabricated on Double SOI Technology
Cheng Zhang,Fanyu Liu,Xiaojing Li,Siyuan Chen,Lei Shu,Lili Ding,Qiwen Zheng,Yong Xu,Xiao Yu,Jing Wan,Zhengsheng Han,Bo Li,Tianchun Ye
DOI: https://doi.org/10.1109/ted.2024.3449249
IF: 3.1
2024-09-28
IEEE Transactions on Electron Devices
Abstract:The impact of the total ionizing dose (TID) on low leakage electrostatic discharge (ESD) protection devices fabricated on the 180-nm double silicon on insulator (DSOI) technology is investigated through experiments and numerical simulations. The devices under tests (DUTs) are MOS-DIO, MOS-SCR, and gate-grounded NMOSFET (GGNMOS). The transmission line pulse (TLP) measurements were carried out before and right after 60Co gamma ray irradiation. The results show that the radiation-induced charges and traps mainly located in the top buried oxide (BOX1) can lead to deterioration of ESD characteristics, such as leakage and triggering voltage. After being irradiated to a dose of 300 krad(Si), the leakage of GGNMOS increases by about three orders of magnitude, and in addition, its snapback characteristic vanishes. Radiation hardness on DSOI-based ESD devices is analyzed based on experiment and simulation results, which implies that the negative voltage on back-gate electrode can mitigate the deterioration of ESD characteristics caused due to irradiation.
engineering, electrical & electronic,physics, applied