Abstract:High power light emitting diodes (LEDs) have begun to play an important role in many illumination applications due to their excellent performance in terms of high efficiency, low power consumption, high reliability and long life. With the rapid development of the LED industry, the reliability is becoming essential for the large scale applications of LED devices, modules and systems. Generally the thermal cycling and thermal shock test are conducted for validation the reliability performance and exposure the potential design problems during the new packaging development. In this paper, the reliability performance of the typically LED package is evaluated by the accelerated stress test under thermal cycling and thermal shock conditions. The optical degradation and electrical parameters variation of the LED package are monitored during the experiments. The thermo-mechanical responses of the LED package under thermal cycling and thermal shock loadings are investigated by sequential coupling thermo-mechanical finite element modeling interoperated with nonlinear time and temperature dependence materials properties. The stress and strain behavior of the LED package especially of the gold wire is examined. The effects of thermal gradient in the LED package during the thermal cycling and thermal shock tests and the time and temperature dependent materials property of the silicone on the reliability performance of the LED package are investigated. The physical mechanisms of failure of LED package samples are analyzed by decapulation and optical microscopic detection method. These efforts are helpful for design of reliability for the high power LED packaging development.

Influence of Lens Structure on the Mechanical Strength of High-Power Light Emitting Diodes

Optical Design in Packaging and Illuminating System for High Power Light-Emitting Diodes for Projection System

Influence of High Overload on the Collimating Lenses of Laser Ranging Systems

Reliability Test and Failure Analysis of High Power LED Packages

Effect mechanism of moisture diffusion on LED reliability

Comparison of LED Package Reliability under Thermal Cycling and Thermal Shock Conditions by Experimental Testing and Finite Element Simulation

Life Test and Failure Mechanism Analyses for High-power LED

A Statistical Study to Identify the Effects of Packaging Structures on Lumen Reliability of LEDs.

Robustness of Point Light Source Approximation in Lens Design for Light-Emitting Diode Packages

Effect Study of Silicone Amount on the Lumen Maintenance of High Power Led under Accelerated Stress Test

Void Formation and Growth at Solder-Bonded Interfaces in HP LEDs

Structural Design of LED Packaging in Terms of Lumen Reliability by a Statistical Method

Failure Analysis Of Die-Bonding Interfaces Between Led Chip And Heat Sink

Temperatures and Thermal Stresses in High-Power Light Emitting Diodes

A Thermal Analysis of the Operation of Microscale, Inorganic Light-Emitting Diodes

Transient Thermal Analysis of High-power LED Package

Effects of Bonding Materials on Optical–Thermal Performances and High-Temperature Reliability of High-Power LED

Comparative Study of Die-Attach Materials for LED Die Bonding

Analysis of Junction Temperatures in High-Power GaN-based LEDs

Polymer Dispensing and Embossing Technology for the Lens Type LED Packaging

Improvement of high-power LED performance with sintered chip attachment