N-polar GaN Epitaxy and High Electron Mobility Transistors
Man Hoi Wong,Stacia Keller,Sansaptak Dasgupta Nidhi,Daniel J. Denninghoff,Seshadri Kolluri,David F. Brown,Jing Lu,Nicholas A. Fichtenbaum,Elaheh Ahmadi,Uttam Singisetti,Alessandro Chini,Siddharth Rajan,Steven P. DenBaars,James S. Speck,Umesh K. Mishra
DOI: https://doi.org/10.1088/0268-1242/28/7/074009
IF: 2.048
2013-01-01
Semiconductor Science and Technology
Abstract:This paper reviews the progress of N-polar () GaN high frequency electronics that aims at addressing the device scaling challenges faced by GaN high electron mobility transistors (HEMTs) for radio-frequency and mixed-signal applications. Device quality (Al, In, Ga)N materials for N-polar heterostructures are developed using molecular beam epitaxy and metalorganic chemical vapor deposition. The principles of polarization engineering for designing N-polar HEMT structures will be outlined. The performance, scaling behavior and challenges of microwave power devices as well as highly-scaled depletion- and enhancement-mode devices employing advanced technologies including self-aligned processes, n+ (In,Ga)N ohmic contact regrowth and high aspect ratio T-gates will be discussed. Recent research results on integrating N-polar GaN with Si for prospective novel applications will also be summarized.