An Improved Structure to Enhance the Robustness of SiC Power MOSFETs for a Low Ron, Sp

Xintian Zhou,Ruifeng Yue,Gang Dai,Juntao Li,Yan Wang
DOI: https://doi.org/10.1109/edssc.2016.7785223
2016-01-01
Abstract:An improved structure of Silicon Carbide (SiC) power MOSFET with a central implanted region (CIR) introduced to the middle of JFET area to alleviate the high gate oxide field is presented in this paper. Combined with a higher doped current spreading layer (CSL), the CSL+CIR structure can further reduce the specific on-resistance (R on , sp) of the device without the need of a tightened JFET width to protect the gate oxide from the high drain bias. According to the technology computer aided design (TCAD) simulations, the superior performance can be maintained at a wide range of JFET width, resulting in a good compromise between performance development and reduced processing tolerance. Additionally, no extra processing steps are required, which makes the CSL+CIR structure another choice for mass production of SiC power MOSFETs.
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