Carbon Nanotube Enhanced CMOS Interconnect

Suwen Li,Changjian Zhou,Salahuddin Raju,Mansun Chan
DOI: https://doi.org/10.1109/inec.2016.7589426
2016-01-01
Abstract:This paper describes the potential of using carbon nanotube (CNT) as a via-filling material to enhance the performance mainstream CMOS technology. Due to the CMOS compatibility constraint, the choice of catalyst material and processing conditions have been significantly limited. After a careful selection process, Ni is found to be a workable material. Through catalyst engineering, we have demonstrated that it is possible to form CNT filled vias on metal or silicide substrate at low temperature with low contact resistance. The impact of via dimensions and processing condition has also been studied. Based on statistical analysis using measured data, the best-case projected via resistance for a 30nm via is 295Ω, which is within one order of magnitude of its copper and tungsten counterparts.
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