Contact Resistance and Reliability of 40 Nm Carbon Nanotube Vias

Anshul A. Vyas,Cary Y. Yang,Phillip Wang,Changjian Zhou,Yang Chai
DOI: https://doi.org/10.1109/iitc-amc.2016.7507732
2016-01-01
Abstract:Carbon nanotubes (CNTs) are promising materials for on-chip interconnect contacts and vias. We report results on 40 nm top-contact metallized CNT vias consisting of the first experimentally extracted contact resistance for this linewidth and current-carrying capacity two orders of magnitude higher than their Cu and W counterparts, well above the ITRS roadmap specifications. To obtain via resistance comparable to those of Cu and W, contact engineering remains a challenge but can be facilitated with the reported contact resistance extraction scheme.
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