Self-Selection RRAM Cell with Sub- $\mu \text{a}$ Switching Current and Robust Reliability Fabricated by High- $K$ /metal Gate CMOS Compatible Technology

Peng Huang,Sijie Chen,Yudi Zhao,Bing Chen,Bin Gao,Lifeng Liu,Yong Chen,Ziying Zhang,Weihai Bu,Hanming Wu,Xiaoyan Liu,Jinfeng Kang
DOI: https://doi.org/10.1109/ted.2016.2612824
2016-01-01
Abstract:A high-K/metal gate (HKMG) stack (TiN/Al-doped-HfO X /SiO 2 /Si) based bipolar RRAM cell is proposed and fabricated by 28/20nm HKMG CMOS compatible technology. Robust reliability behaviors (retention @200 °C >4×10 4 s and endurance > 10 5 ) and sub-μA switching current are both demonstrated. The sub-μA switching current and self-selection nonlinear I-V characteristics are attributed to the SiO 2 interfacial layer rather than the decrease of conductive filament (CF) size and oxygen vacancy (V O ) density, which can be verified by HRTEM and measured conduction behavior. Therefore, robust reliability property is also achieved. The demonstrated excellent memory characteristics of HKMG stacked RRAM cell can constitute workable 1 Mb crosspoint array when feature size scales down to 10 nm according to the HSPICE simulation.
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