Reliable doping technique for WSe<inf>2</inf> by W:Ta co-sputtering process

Po-Yen Chien,Ming Zhang,Shao-Chia Huang,Min-Hung Lee,Hung-Ru Hsu,Yen-Teng Ho,Yung-Ching Chu,Chao-An Jong,Jason C. S. Woo
DOI: https://doi.org/10.1109/SNW.2016.7577984
2016-01-01
Abstract:The electrical and material properties of WSe <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</inf> doped by W:Ta co-sputtering process were examined. High acceptor doping concentration (6×10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">13</sup> cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">−2</sup> ) and good effective hole mobility (16.5cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> /Vs) were realized. As a result, low sheet resistance (17kΩ/sq) and contact resistance with Pd metal (11.4kΩ-µm) were measured using TLM structures.
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