Abstract:Future inter- and intra-ULSI interconnect systems demand extremely high data rates (up to 100 Gbps/pin or 20-Tbps aggregate) as well as bidirectional multiI/O concurrent service, re-configurable computing/processing architecture, and total compatibility with mainstream silicon system-on-chip and system-in-package technologies. In this paper, we review recent advances in interconnect schemes that promise to meet all of the above system requirements. Unlike traditional wired interconnects based solely on time-division multiple access for data transmission, these new interconnect schemes facilitate the use of additional multiple access techniques including code-division multiple access and frequency-division multiple access to greatly increase bandwidth and channel concurrency as well as to reduce channel latency. The physical transmission line is no longer limited to a direct-coupled metal wire. Rather, it can be accomplished via either wired or wireless mediums through capacitor couplers that reduce the baseband noise and dc power consumption while simplifying the fabrication process by eliminating vertical metal studs needed in three-dimensional ICs. These new advances in interconnect schemes would fundamentally alter the paradigm of ULSI data communications and enable the design of next-generation computing/processing systems.

A Novel Transmission Line Structure for High-Speed High-Density Copper Interconnects

A Novel Dieletric Slot Stripline Structure for Millimeter Wave Flexible Printed Circuit

Advanced RF/baseband Interconnect Schemes for Inter- and Intra-Ulsi Communications

High-Speed Transmission Cable Performance- Simulations and Measurements

A Wideband Model for On-Chip Interconnects with Different Shielding Structures

Transmission Line Modeling and Crosstalk Analysis of Multibraided Shielded TWP/Twinax Cables

Sub-THz Interconnect for Planar Chip-to-Chip Communications

High‐frequency Modeling of Cu‐graphene Heterogeneous Interconnects

A Novel Transmitarray Using Double-layer Hexagonal Element with Vias

Modeling of Carbon Nanotube Interconnects and Comparative Analysis with Cu Interconnects

RF-interconnect for multi-Gb/s digital interface based on 10 GHz RF-modulation in 0.18 /spl mu/m CMOS

Electrical Modeling of Three-Dimensional Carbon-Based Heterogeneous Interconnects

SIGNAL PROPAGATION IN HIGH SPEED DIFFERENTIAL TRANSMISSION LINE USING PARALLELIZED FINITE-DIFFERENCE TIME-DOMAIN METHOD

Double-Shielded Interposer with Highly Doped Layers for High-Speed Signal Propagation

Parallelized Computational Technique for Signal Propagation Analysis at Very High Speed Differential Transmission Lines

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

Altered Phase Velocity Lines For Low Crosstalk Microstrip Interconnection Of High-Speed Digital Circuits: Design And Experimental Validation

Signal Propagation Effects on High‐speed Interconnection Lines Using Time‐domain Numerical Technique

Design and Experimentally Verification of a Vertical Coaxial Transmission Structure in High resistivity Si Interposer

Investigations on Delay Interconnect Lines for High-Speed Designs with the Numerical Technique

A Shielding Structure for Crosstalk Reduction in Silicon Interposer