Abstract:In order to achieve desired mechanical properties of alloys by manipulating grain boundaries (GBs) via solute decoration, it is of great significance to understand the underlying mechanisms of microstructural evolution and plastic deformation. In this work, nanocrystalline (NC) Cu-W alloyed films with W concentrations spanning from 0 to 40 at% were prepared by using magnetron sputtering. Thermal stability (within the temperature range of 200 °C-600 °C) and hardness of the films were investigated by using the x-ray diffraction, transmission electron microscope (TEM) and nanoindentation, respectively. The NC pure Cu film exhibited substantial grain growth upon all annealing temperatures. The Cu-W alloyed films, however, displayed distinct microstructural evolution that depended not only on the W concentration but also on the annealing temperature. At a low temperature of 200 °C, all the Cu-W alloyed films were highly stable, with unconspicuous change in grain sizes. At high temperatures of 400 °C and 600 °C, the microstructural evolution was greatly controlled by the W concentrations. The Cu-W films with low W concentration manifested abnormal grain growth (AGG), while the ones with high W concentrations showed phase separation. TEM observations unveiled that the AGG in the Cu-W alloyed thin films was rationalized by GB migration. Nanoindentation results showed that, although the hardness of both the as-deposited and annealed Cu-W alloyed thin films monotonically increased with W concentrations, a transition from annealing hardening to annealing softening was interestingly observed at the critical W addition of ∼25 at%. It was further revealed that an enhanced GB segregation associated with detwinning was responsible for the annealing hardening, while a reduced solid solution hardening for the annealing softening.

NETWORK FRACTAL AND ANNEALING-INDUCED AGGREGATION OF Cu/a-C:H BILAYER FILMS

Deformation-induced Interfacial Transition Zone in Cu/V Nanolamellar Multilayers

Annealing Improved Ductility and Fracture Toughness of Nanocrystalline Cu Films on Flexible Substrates

THERMAL DYNAMICS OF Te CLUSTER FILM AT ANNEALING PROCESSES

Fractal Structure Appeared in Ion-Implanted A-Ge/ag Bilayer Films after Annealing

Length Scale Effect on the Thermal Stability of Nanoscale Cu/Ag Multilayers

Barrier layer and annealing temperature dependent microstructure evolution of nanocrystalline Cu films

Research on Deforming Mechanism of Nanocrystalline Cu Thin Film under Contact Deformation

The W alloying effect on thermal stability and hardening of nanostructured Cu-W alloyed thin films

Experimental observation and simulation of fractal patterns of Au/Ge bilayer films

Influence of Post-Annealing Treatment on the Morphology of Au Films Deposited on Liquid Surfaces

Effect of the Diffusion Annealing on Concentration Distributions in interfacial Regions of Au/Ag-Cu/Cu-Ni-Zn Laminate Strips

Interface Fractal Construction In Ni/Kbr/Ni System

ANISOTROPY BEHAVIOR OF SURFACE MORPHOLOGY AND PHASE STRUCTURE OF Cu-W THIN FILMS

Interface fractal construction in Ni{plus 45 degree rule}KBr{plus 45 degree rule}Ni system

Effect Of Diffusion Annealing On Microstructure And Composition Distribution In Interfacial Regions Of Silver-Copper Bimetallic Sheets

Multifractal Behavior of Crystallization on Au/Ge Bilayer Films

Behaviors of the Interface and Matrix for the Ag/Cu Bimetallic Laminates Prepared by Roll Bonding and Diffusion Annealing

Fractal formation and tunnelling effects on the conductivity of Au/a-Ge bilayer films

Mechanism of the formation of copper‐containing fractal‐like crystallites in metal‐organic thin films: Shape simulation and XANES analysis

A molecular dynamics investigation into deformation mechanism of nanotwinned Cu/high entropy alloy FeCoCrNi nanolaminates