Abstract:Tin-lead solder alloys have long and widely been used in the electronics industry because of their abundance in natural deposits, low cost, suitable melting points and excellent soldering properties. Practically almost all of the microelectronic assemblies in use today utilize Sn-Pb solders for various interconnection applications. With the advent of chip scale packaging technologies, the usage of soldered connections has increased. But many engineering problems have also been identified with the use of Sn-Pb solders in practice, such as nonwetting, dewetting, bridging. On the other hand, emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in the electronic assemblies, due to the inherent toxicity of Pb. It has therefore made the search for suitable "lead-free" solders an important issue in the microelectronics industry. Up to now, approximately 70 lead-free solder alloy compositions have been proposed. There have also been a lot of research activities in China to face the challenges, and this paper is to review the efforts and successes on lead-free solder research with a few selected examples.

R&D of Lead-free Solder in Tsinghua University

Research and Development of Sn-Zn Lead-free Solder

Lead-tin alloy electroplating applied to superconducting resonator

Experimental Determination of Mechanical Properties for Lead-Free Material SnAgCu

A New Type Lead-free Solder

Progress of study on the lead-free of high temperature Pb-rich solder

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Analysis of New Lead-Free Solder Alloy Microstructure

Study of New Types Lead-Free Solder Alloys of Sn-Ag-Cu-Al-Ni and Sn-Zn-Bi-In-P

Controllable fabrication of Sn–Bi alloy microspheres for improved lead-free solder

Reflow of Lead-Free Solder by Microwave Heating

Fabrication and Properties of Lead-Free Sn-Ag-Cu-Ga Solder Alloy

The study on the new type lead-free solder alloys Sn-Zn-Ga

The Development And Trends Of Lead-Free Solders In China

Effects of Addition Small Amount High Melting Point Metal on Properties of Lead-free Solders

Thermal Property, Wettability and Interfacial Characterization of Novel Sn–Zn–Bi–In Alloys As Low-Temperature Lead-Free Solders

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Research on Reliability of Sn-1.0ag-0.5cu Low-Ag Lead-Free Solder Alloy

Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

Effects of Alloying Elements on the Characteristics of Sn-Zn Lead-Free Solder