Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification

xiaowu hu,yulong li,yi liu,zhixian min

DOI: https://doi.org/10.1016/j.jallcom.2014.10.205

IF: 6.2

2015-01-01

Journal of Alloys and Compounds

Abstract:•The Sn0.7Cu–xBi solder alloys were directionally solidified.•Both spacing and diameter of fibers decreased with increasing solidification rate.•The UTS and YS first increased with increased solidification rate, then decreased.•The UTS and YS of Sn0.7Cu–xBi first increased with increased Bi content.