Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy

Tianhan Hu,Shun Li,Zhen Li,Guanzhi Wu,Ping Zhu,Wufeng Dong,Yu Sun,Jiayi Zhou,Bingjia Wu,Bingge Zhao,Kai Ding,Yulai Gao
DOI: https://doi.org/10.1016/j.jmrt.2023.08.311
IF: 6.267
2023-09-11
Journal of Materials Research and Technology
Abstract:The microstructure and mechanical properties of Sn–Bi solder alloys with various Ag and In addition are comparatively investigated. The results illustrate that the tensile strength and ductility of the solder alloy could be dramatically enhanced with negligible loss of the plasticity. Especially, the Sn–Bi solder alloy with 0.4 wt. % Ag and 1.5 wt. % In exhibits the maximum tensile strength and elongation of 79.7 MPa and 45.9%, respectively. The microstructure of the Sn–Bi solder alloys is mainly composed of Bi-rich and β-Sn phases. With the addition of elements Ag and In, the microstructure is significantly refined, and the lamellar eutectic structure with thinner interlayer spacing could be detected. Element Ag tends to form Ag 3 Sn phase while element In solutes in the Sn matrix. The mechanical properties of the as-prepared Sn–Bi solder alloy are improved attributed to the precipitated-phase strengthening of the fined Ag 3 Sn phase and the refinement effect of In on coarse Bi-rich phase.
materials science, multidisciplinary,metallurgy & metallurgical engineering
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