The Development And Trends Of Lead-Free Solders In China

Js Ma

2001-01-01

Abstract:Tin-lead solder alloys have long and widely been used in the electronics industry because of their abundance in natural deposits, low cost, suitable melting points and excellent soldering properties. Practically almost all of the microelectronic assemblies in use today utilize Sn-Pb solders for various interconnection applications. With the advent of chip scale packaging technologies, the usage of soldered connections has increased. But many engineering problems have also been identified with the use of Sn-Pb solders in practice, such as nonwetting, dewetting, bridging. On the other hand, emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in the electronic assemblies, due to the inherent toxicity of Pb. It has therefore made the search for suitable "lead-free" solders an important issue in the microelectronics industry. Up to now, approximately 70 lead-free solder alloy compositions have been proposed. There have also been a lot of research activities in China to face the challenges, and this paper is to review the efforts and successes on lead-free solder research with a few selected examples.