Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging
Liang Zhang,Jun-hua Cui,Ji-guang Han,Cheng-wen He,Yong-huan Guo,Jian-min Yuan
DOI: https://doi.org/10.1515/ijnsns-2012-0063
2014-01-01
International Journal of Nonlinear Sciences and Numerical Simulation
Abstract:Abstract With the addition of Zn, Co and Fe, the microstructures and properties of SnAgCu solders can be improved obviously, the constitutive response of SnAgCu solder bearing 0.8%Zn, 0.8%Co and 0.8%Fe was studied under uniaxial tension. Anand model was used to represent the inelastic deformation behavior of the lead-free solders. The material parameters of the constitutive relations for SnAgCu(Zn,Co, Fe) solders were determined from separated constitutive relations and experimental results. Combining the model, finite element analysis (FEA) was used to study the thermally induced inelastic deformation and the stress-strain response of the solder joints in wafer-level chip scale packages (WLCSP) mounted on printed circuit boards (PCB). And it is found that the addition of Zn, Co and Fe can enhance the fatigue life of SnAgCu solder joint, the superiority can be found for the addition of Fe among the three elements.
mechanics,engineering, multidisciplinary,mathematics, applied,physics, mathematical