Lead-free Jointing Technology and Analysis of Its Failures

HUANG Zhuo,YANG Jun,ZHANG Li-ping,CHEN Qun-xing,TIAN Min-bo

DOI: https://doi.org/10.3969/j.issn.1001-2028.2006.05.020

2006-01-01

Abstract:The characteristics of the lead-free jointing technology and the main causes of its failures were summarized,include lift-off,solderpoint voids and Sn whisker etc.Also some methods to avoid or lower these failures were given.

What problem does this paper attempt to address?

Properties and Reliability of Sn-Pb and Lead-Free Mixed Soldering

Huan Wang,Anmin Hu,Lihong Wang,Li Zhao,Ping Zhu,Chengkang Chang,Ming Li

DOI: https://doi.org/10.1109/icept.2007.4441544

2007-01-01

Abstract:During the transition from Sn-Pb solder to lead-free solder, it is inevitable to encounter the reliability difficulties when lead-free and Sn-Pb materials were used within the same mounting process. To solve the problem in the mixed soldering, two methods were adopted that is improving the soldering temperature and electroplating Sn-Pb on the surface of the devices then soldering in a lower temperature. Mechanical strength of the solder joint, fracture morphology and the intermetallic compound (IMC) at the interface between solder and board materials were investigated. The experimental. results showed the inclination of pores evolving when improving the solder temperature reduces the reliability However, symmetrical solder joint with high reliability was obtained in the second method.
Reliability issues of lead-free solder joints in electronic devices

Nan Jiang,Liang Zhang,Zhi-Quan Liu,Lei Sun,Wei-Min Long,Peng He,Ming-Yue Xiong,Meng Zhao

DOI: https://doi.org/10.1080/14686996.2019.1640072

IF: 7.821

2019-09-02

Science and Technology of Advanced Materials

Abstract:Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.Graphical Reproduced by permission from Zhang et al., J Mech Eng. 2012;48(24):56–60.Reproduced by permission from Zhang et al., J Mech Eng. 2012;48(24):56–60.

materials science, multidisciplinary
Recent Development of Lead-Free Solder in Electronic Packaging

HUANG Zhuo,ZHANG Li-ping,CHEN Qun-xing,TIAN Min-bo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2006.11.004

2006-01-01

Abstract:Along with the issue of WEEE/RoHS, electronic packaging industry raised the furtherrequirement for lead-free jointing. The three substitutes of lead-free solder were brought forwardaccording to the recent research. Three main weaknesses about the lead-free solder being usednowadays were summarized, and a summarization of the advantages and disadvantages about theinternational recommended lead-free solders were made as well.
Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Lei Sun,Liang Zhang

DOI: https://doi.org/10.1155/2015/639028

IF: 2.0981

2015-01-01

Advances in Materials Science and Engineering

Abstract:SnAgCu solder alloys were considered as one of the most popular lead-free solders because of its good reliability and mechanical properties. However, there are also many problems that need to be solved for the SnAgCu solders, such as high melting point and poor wettability. In order to overcome these shortcomings, and further enhance the properties of SnAgCu solders, many researchers choose to add a series of alloying elements (In, Ti, Fe, Zn, Bi, Ni, Sb, Ga, Al, and rare earth) and nanoparticles to the SnAgCu solders. In this paper, the work of SnAgCu lead-free solders containing alloying elements and nanoparticles was reviewed, and the effects of alloying elements and nanoparticles on the melting temperature, wettability, mechanical properties, hardness properties, microstructures, intermetallic compounds, and whiskers were discussed.

materials science, multidisciplinary
Mechanical Behaviors of Sn-based Solder Joints in Electronic Packaging and Assembly

AN Rong,HANG Chun-jin,LIU Wei,ZHANG Wei,TIAN Yan-hong,WANG Chun-qing

DOI: https://doi.org/10.14176/j.issn.1001-3474.2013.02.005

2013-01-01

Abstract:With the development of surface packaging technology,Soldering technology has widely served as a familiar route for interconnection between chips and substrates and for joining of substrates and print circuit boards.By now,the failure of solder joints in electronic packaging and assembly becomes a main problem concerning electronics reliability.Hence,it is necessary to describe mechanical behaviors of Sn-based solder joints and to characterize the constitutive relationship.Reviewed the results about mechanical behaviors of solder joints in terms of constitutive relationship,life prediction model,and fracture mechanisms.
Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection

Zhang Liang,Han Yongdian,Yin Limeng,Hu Xiaowu,Sun Lei

DOI: https://doi.org/10.12442/j.issn.1002-185X.20220810

2023-01-01

Rare Metal Materials and Engineering

Abstract:For the creep failure of lead-free solders and solder joints in recent years, the creep deformation behavior and its application in reliability of solder joint were reviewed. Firstly, the creep behavior of lead-free solders was systematically introduced, and the creep modification mechanism of lead-free solders bearing alloying elements or particles was discussed. Secondly, the creep behavior of solder joints was reviewed, and the research progress about the influence of solder joint composition and substrate materials on the creep behavior of solder joints was analyzed. Furthermore, for specific electronic devices, the creep response and fatigue life prediction of solder joints based on finite element method were analyzed by finite element simulation, and the reliability of solder joints was evaluated. Finally, the future development of creep behavior of lead-free solder and solder joint was prospected, and the existing problems and solutions were analyzed to provide theoretical support for further research on solder joint reliability.
Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

Ping Lin,Wensheng Liu,Yunzhu Ma,Yufeng Huang,Siwei Tang

DOI: https://doi.org/10.1007/s10854-020-04438-9

2020-09-14

Abstract:With the requirement of lead-free soldering technology in electronic industry for manufacturing lead-free electronic devices, Au80Sn20 solder has been developed and applied in high-power devices due to its excellent physical and chemical properties. However, the application of new type of chip in high-power devices leads to the exposure of the Au80Sn20 solder joints to the complex environment of temperature cycle and current switch cycle, which seriously affects the reliability of solder joints in practical applications. In this study, the solder joint structure and simulation platform were designed independently. The failure mechanism of Au80Sn20/AlN substrate solder joint under temperature cycle and current switch cycle was studied by analyzing the changes in morphological characteristics of solder joint and composition in different working times. It was found that the failure process of solder joint involved the generation of steps along the grain boundary and phase boundary, and the failure was caused by the gradual expansion of steps. Owing to the uneven distribution of Cu and Ni in Au5Sn and AuSn phases, the volume difference among different phases was generated, which promoted the formation of phase boundary steps. The grain boundary steps were formed due to the formation of Au3Cu phase at the grain boundary, resulting in the volume difference between grain boundary and grain. Based on the research results, the idea of improving solder joint reliability by adjusting microstructure of Au80Sn20 solder is put forward, which plays a theoretical guiding role in the optimization of targeted performance of Au80Sn20 solder.
Thermal Fatigue Process of Novel Sn-Zn System Lead-Free Solder Joint

Geng Zhiting,He Qing,Chen Guohai,Ma Jusheng

2012-01-01

Rare Metal Materials and Engineering

Abstract:Thermal fatigue failure is the main form of electronic package solder failure. In this paper, by means of establishing experimental model, the solder stress-strain changes of Pb-Sn eutectic solder and the novel Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and the rule of solder joint mechanical properties parameters changed with thermal fatigue times was obtained. The experimental result can provide the accurate boundary conditions for finite element analysis estimation of the solder joint reliability.
The Development And Trends Of Lead-Free Solders In China

Js Ma

2001-01-01

Abstract:Tin-lead solder alloys have long and widely been used in the electronics industry because of their abundance in natural deposits, low cost, suitable melting points and excellent soldering properties. Practically almost all of the microelectronic assemblies in use today utilize Sn-Pb solders for various interconnection applications. With the advent of chip scale packaging technologies, the usage of soldered connections has increased. But many engineering problems have also been identified with the use of Sn-Pb solders in practice, such as nonwetting, dewetting, bridging. On the other hand, emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in the electronic assemblies, due to the inherent toxicity of Pb. It has therefore made the search for suitable "lead-free" solders an important issue in the microelectronics industry. Up to now, approximately 70 lead-free solder alloy compositions have been proposed. There have also been a lot of research activities in China to face the challenges, and this paper is to review the efforts and successes on lead-free solder research with a few selected examples.
Research and Development of Sn-Zn Lead-free Solder

黎小燕,陈国海,马莒生

DOI: https://doi.org/10.3969/j.issn.1001-3474.2004.04.004

2004-01-01

Abstract:Environment protection has been a part of state sustainable development.As lead pollutes environment and do harm to the health of human and animals,the use of lead solder is limited.It is necessary for the electronic industry to develop a new lead-free solder.Sn-Zn alloy is a candidate for the traditional lead-tin solder substitute.The research of Sn-Zn has been reviewed.The effect of elements in the alloy and the interface between solder and substrate after soldering have mainly been discussed. Some suggestions for improving the performance of Sn-Zn alloy has been presented.
Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking

Hongbo Xu,Fa Liu,Li Zhou,Hongyun Zhao,Mingyu Li

DOI: https://doi.org/10.1016/j.microrel.2020.113623

IF: 1.6

2020-01-01

Microelectronics Reliability

Abstract:The purpose of this paper is to make a comprehensive understanding of the trends between the lifetime and the thermomechanical test setup parameters, based on the physical failure mechanism of SnAgCu solder interconnections in the component boards. The thermomechanical tests, including thermal cycling and thermal shock, were employed to investigate the failure of the component boards under different loading conditions. The in situ observation during the thermomechanical tests was employed to study the microstructure evolution and the crack propagation of solder interconnections. Electrical failures of the component boards under all setup conditions are mainly caused by the cracks, which propagate along the continuous network of the high-angle grain boundaries produced by the distinguished recrystallization of solder interconnections. The propagation of cracks is highly dependent on the expansion of the recrystallized volume in the solder interconnections. In addition, the expansion of the recrystallization would be influenced by the setup parameters of the thermomechanical test. The paper discusses the relationship among the four factors of the lifetime, the crack growth, the restoration phenomenon and the test setup parameters, in order to explain the complicated trend between the component board lifetime and the setup parameters.
Solder Joint in Electronic Packages and Its Reliability

WANG Qian,Shi-Wei Ricky LEE,WANG Gang-qiang,GENG Zhi-ting,HUANG Le,TANG Xiang-yun,Ma Ju-sheng

DOI: https://doi.org/10.3969/j.issn.1001-2028.2000.02.012

2000-01-01

Abstract:ELECTRONIC COMPONENTS MATERIALS (China), Vol 19, No 2, P 24 26 (Apr 2000) In Chinese Failure of a single solder joint in an electronic package may cause the overall failure of the device, even the whole system Failures of solder joints usually result from the growth of creep/fatigue crack under thermal cycling The research of solder joints and its reliability is introduced, with respects of solder joint microstructure, failure analysis, reliability forecast, etc (12 refs )
Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

S. Peng

Abstract:Two key technologies in electronics industry are chip technology and packaging technology. Solder plays a crucial role in the assembly and interconnection in the electronic packaging industry. As a joint material, solder provides electronic, thermal and mechanical continuity. The eutectic Sn-Pb alloy has been widely used in surface mount technology (SMT) for the interconnection and mechanical support between electronic components and printed circuit boards (PCB). During the last decades, there have been strong worldwide environmental movements towards "green" non-toxic electronic products. Initiatives and legislation forced the electronics industry to replace lead containing products with more environmental friendly, lead free products. Sn-Zn solder system is therefore a promising candidate, recommended for its low melting temperature, around 200°C, which is close to the melting temperature of the traditional binary tin lead solder. But the low cycle fatigue data of Sn-Zn solder system has not been reported yet and the lack of reliability data is one of the barriers to the application of the Sn-Zn system solder alloy. The aim of the present work is to investigate the low cycle fatigue behaviour of the lead-free Sn-8Zn-3Bi solder joint using lap shear test samples. Finite element simulation is presented and the Coffin-Mason equation for Sn-8Zn-3Bi solder joint is given based on the experimental and simulation results: Nf = 0.0294 ()-2.833 Where the Nf is the number of cycles to failure and  is the plastic shear strain. Another important issue, related to reliability of solder joints that has been investigated in this work, is the intermetallic compounds (IMCs). Generally, the interconnection by the solder joint is completed by the formation of IMCs at the interface and the reliability of the whole package is affected by IMCs due to their inherent brittle nature and tendency to generate structural defects. The interfacial reaction of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on Au/electroless Ni metallization after high temperature storage (HTS) testing at 150°C is investigated for the reliability of electronic production from the metallurgical viewpoint in this work. It is noticed that Ni3Sn4 intermetallic compounds (IMCs) are found in the Sn-Ag system, while two kind of interfacial productions that are (Ni,Cu)3Sn4 IMC layer and (Cu,Ni)6Sn5 spalling compound gains exists in the Sn-Ag-Cu system. Kirkendall voids are found in both lead free solder joints and clear gap exists at the interface for the case of Sn-Ag solder joint after 1000 hour aging.

Materials Science,Engineering,Environmental Science
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Shuai Li,Xingxing Wang,Zhongying Liu,Feng Mao,Yongtao Jiu,Jinyong Luo,Linjian Shangguan,Xiangjie Jin,Gang Wan,Shuye Zhang,Peng He,Weimin Long

DOI: https://doi.org/10.1155/2020/8843166

IF: 3.791

2020-01-01

Journal of Nanomaterials

Abstract:With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.
Analysis of New Lead-Free Solder Alloy Microstructure

Geng Zhiting,Heqing,Cheng Guohai,Ma Jusheng

DOI: https://doi.org/10.1109/icept-hdp.2012.6474661

2012-01-01

Abstract:Combining with the analysis of solder melting point, spreading rate and tensile strength, a new Sn-Zn lead-free solder system has been developed. The solder melting point is 183 °, it is very close to Pb-Sn eutectic solder melting temperature, the corresponding melting range of this solder is smaller, and it has higher bonding force and other advantages, completely meeting the requirements of the electronic industry. Because the material performances are Influenced by the microstructure, so the alloy microstructure was investigated, and the influencing factors of the alloy microstructure on properties have been found.
Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

F.A. Stam,E. Davitt

DOI: https://doi.org/10.1016/s0026-2714(01)00087-7

IF: 1.6

2001-11-01

Microelectronics Reliability

Abstract:Accelerated reliability tests have been performed on leadless and leaded lead-free and lead containing SMT component assemblies. Results so far have shown that lead-free reflow soldering is a viable alternative for conventional lead based reflow soldering. The selected ternary eutectic solder alloy SnAg3.8Cu0.7 requires higher processing temperatures which could restrict the use of certain board and component types, but other than that no major modifications seem necessary. Although better SnAg3.8Cu0.7 bulk mechanical properties were obtained compared to the near eutectic lead bearing bulk solder properties, reflowed solder joints did not reflect this difference. In general, quite similar reliability results were obtained as found for the lead based solders. Dependent on board and component metallisations and use environment, the reliability of the lead-free solders could perform better or worse than the lead based solders. Temperature dependent aspects such as solderability and mechanical behaviour of the lead-free assemblies could play a role in this. Although microstructural differences can be seen between the lead-free and lead bearing solder joints, similar joint failure mechanisms occur. Resistor solder joint cracks propagate from underneath the component through either transgranular (lead-free) grains or along intergranular (lead) grain boundaries between lead-rich and tin-rich areas and into coarsened regions near the component terminations. Gullwing lead cracks were seen propagating from the heel fillet along the lead/solder interfacial intermetallic mostly (some cracks started in the heel fillet and propagated through the solder body dispersed with coarsened spherical Ag3Sn intermetallic particles). Package design and leadframe material seem to play a more important role in the fatigue mechanism than the change in microstructure of the solder joint.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Progress of study on the lead-free of high temperature Pb-rich solder

ZENG Qiu-lian,GU Xiao-long,ZHAO Xin-bing,CHEN Chao-zhong,LIU Xiao-gang

DOI: https://doi.org/10.3969/j.issn.1001-2028.2008.08.005

2008-01-01

Abstract:The lead-free of the Pb-rich solder applied in high temperature region is a global difficulty in microelectronic packaging industry. The development of study on high temperature lead-free solders such as 80Au-20Sn, Bi-based alloys, Sn-Sb based alloys and Zn-Al based alloys was reviewed. Comprehensive properties of the solders were summarized in terms of melting behaviors, mechanical properties, conductivity and thermal conductivity, wetting behaviors, interface reactions and joint reliabilities, etc of such lead-free solders in application were mentioned. By comparison, Sn-Sb based alloy is considered as a great prospect to replace the Pb-rich solder in high temperature application regime.
Welding Failure Analysis of Soft Solder of Large Power Devices

吕德春,包生祥,马丽丽,王娇

DOI: https://doi.org/10.3969/j.issn.1006-3757.2008.03.005

2008-01-01

Abstract:Aimed at the problem of fine solder in large power devices,the microstructure and components of SnPb soft solder of device are analyzed and the failure modes for polishing are documented.The failure causes are discussed: the remains of Aluminum Oxide are still in the solder and result in the deterioration of soft solder.According to the analysis,improved measures are suggested.Experiment results significantly favored the processing of SnPb soft solder in large power devices.
Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Jie Wu,Song-bai Xue,Jing-wen Wang,Shuang Liu,Yi-long Han,Liu-jue Wang

DOI: https://doi.org/10.1007/s10854-016-5407-3

2016-07-23

Abstract:Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC package, a major concern of Sn–Ag–Cu based solders today is continuously focused on extending service life of solder bonding formed between solders and substrates. The critical issues and improvements on Sn–Ag–Cu solders bearing alloys and nanoparticles are outlined and evaluated in this review. It can be summarized that appropriate content of certain alloys or nanoparticles addition to Sn–Ag–Cu solder is possible to tailor the solder properties, such as the melting and solidification behaviors, oxidation resistance, wettability, (interfacial) microstructure, and mechanical properties. Worthy of note is that reliability issues such as creep behavior, thermomechanical fatigue, electromigration, thermomigration and Sn whisker were briefly discussed and analyzed to lay down a solid foundation for the future development of 3D IC technology.
Structure and properties of Sn-Cu lead-free solders in electronics packaging

Meng Zhao,Liang Zhang,Zhi-Quan Liu,Ming-Yue Xiong,Lei Sun

DOI: https://doi.org/10.1080/14686996.2019.1591168

IF: 7.821

2019-05-07

Science and Technology of Advanced Materials

Abstract:With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research.This figure presents the interface morphology of Sn-Cu-Ni-xPr joint. (a) x = 0, (b) x = 0.05wt%. It was clear that with the addition of 0.05% Pr, the thickness of IMC layer decreases significantly and the formation of voids at the interface is inhibited.

materials science, multidisciplinary

Lead-free Jointing Technology and Analysis of Its Failures

Properties and Reliability of Sn-Pb and Lead-Free Mixed Soldering

Reliability issues of lead-free solder joints in electronic devices

Recent Development of Lead-Free Solder in Electronic Packaging

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Mechanical Behaviors of Sn-based Solder Joints in Electronic Packaging and Assembly

Development of Creep Behavior of Lead-free Solders and Solder Joints in Electronic Interconnection

Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

Thermal Fatigue Process of Novel Sn-Zn System Lead-Free Solder Joint

The Development And Trends Of Lead-Free Solders In China

Research and Development of Sn-Zn Lead-free Solder

Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking

Solder Joint in Electronic Packages and Its Reliability

Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Analysis of New Lead-Free Solder Alloy Microstructure

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

Progress of study on the lead-free of high temperature Pb-rich solder

Welding Failure Analysis of Soft Solder of Large Power Devices

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging