Abstract:The copper crystal cone-shaped micro-nanostructure is used as the substrate, and the Ni-W alloy layer and Au nanolayer are plated sequentially. Instantaneous soldering with lead-free solder is realized under ultrasonic assistance at room temperature. This solves the residual stress and thermal damage caused by high melting point lead-free solder on thin chips and thermal components, and ensures the safety and reliability of electronic components. Copper-based microstructures are deposited by electrochemical methods. An amorphous Ni-W alloy layer with a thickness of 180 nm is deposited on the Cu-based microstructures by adjusting the atomic ratio of the plating solution. The Ni-W layer is further coated with a 50 nm Au layer to prevent oxidation. Solid-phase transient soldering is realized by combining the Au/Ni-W multilayer thin-film-modified Cu substructures with commercial solder (SAC305) for a holding time of 3 s at a soldering pressure of 10,000 gf (20 MPa) while ultrasonically assisted. The soldered samples are aged at 180 °C for 10 min, 30 min, and 60 min, respectively. Copper substructures with different surface modifications are subjected to destructive shear experiments with solder balls. Scanning electron microscope and X-ray fluorescence thickness gauge are used to study the microstructure, intermetallic compound (IMC) composition thickness and properties of the soldered interface and section. The cone height of the Cu-based structure is 2-4 μm, and the diameter of the bottom is 800 nm-1200 nm, which has a sharp tip and an excellent L/D ratio. The interface between the Au/Ni-W modified Cu substructure and the solder ball is almost free of holes. The average shear strength at the soldering interface is about 43.06 MPa. The fracture surface after the shear experiment basically occurs inside the solder ball matrix, which belongs to the pure toughness fracture. The interface between the Au/Ni-W-modified Cu-based structure and the solder ball is subjected to long aging treatment at 180 °C. The soldering interface showed a "bright layer". New phases are generated on the solder side above the "bright layer", while no new phases appear on the Cu substructure side below the "bright layer". The copper-based microstructure is inserted into the inside of the solder ball to form an inlay and produce mechanical interlocking. Au/Ni-W alloy modification layer can effectively improve the surface hardness of copper-based structures. This creates a large hardness difference with soft solder and enables the formation of fewer holes in the insertion solder. Amorphous Ni-W alloys are prone to form dense oxide films during ultrasonication. The Au film modification prevents oxide generation and increases the average shear strength of the soldering interface. The Ni-W alloy layer retards the interdiffusion between Cu-Sn, blocks the excessive growth of Cu-Sn IMCs, and reduces the reliability problems caused by interface failure.

Characteristic morphologies that cause failure of Au80Sn20/AlN substrate solder joint under combined temperature cycle and current switch cycle tests

Experimental and Statistical Study of the Fracture Mechanism of Sn96.5Ag3Cu0.5 Solder Joints via Ball Shear Test

Study on temperature cycling reliability of Sn-5Sb-0.5Cu-0.1Ni-0.5Ag/Cu micro solder joints

Low Cycle Fatigue Reliability and Interfacial Reaction of Lead-free Solder Joints for Electronic Packaging

Current-induced solder evolution and mechanical property of Sn-3.0Ag-0.5Cu solder joints under thermal shock condition

Microstructural evolution of joints with and without Sb, Ni in Sn58Bi solder under electro-thermal-force coupling

Solid-phase transient soldering method based on Au/Ni-W multilayer thin-film-modified copper-based structures

Effects of thermomechanical cycling on lead and lead-free (SnPb and SnAgCu) surface mount solder joints

The coupling effects of thermal cycling and high current density on Sn58Bi solder joints

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

A novel insight into Au-Au thermosonic flip chip joint under extreme thermal cycles: Defect characterization and failure analysis

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

Interface evolution and mechanical properties of Sn–36Pb–2Ag solder joints under different aging conditions

Mechanical Properties and Evolution Behaviors of Different Sn63Pb37 Solders Under Reliability Test

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

The microstructure evolution and failure mechanism of Sn37Pb solder joints under the coupling effects of extreme temperature variation and electromigration

Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints

Structure and Properties of Au–Sn Lead-Free Solders in Electronic Packaging

Structure and properties of Sn-Cu lead-free solders in electronics packaging

Effects of Al on the failure mechanism of the Sn–Ag–Zn eutectic solder