A New Solder Technology: Rinse-free Flux and Lead-free Solder Tin Paste

卢云,杨邦朝,冯哲圣

DOI: https://doi.org/10.3969/j.issn.1001-2028.2002.10.011

2002-01-01

Abstract:Rinse-free flux and lead-free tin solder paste are discussed, including their development, performances, features and existing problems. The research on and the application in the electronic assembly technology of the two materials are reviewed.

What problem does this paper attempt to address?

Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology

SHI Jian-wei,HE peng,QIAN Yi-yu,YUAN He-ping

DOI: https://doi.org/10.3969/j.issn.1004-4507.2006.12.007

2006-01-01

Abstract:With higher density assembly and smaller devices, fine pitch leader requires perfect solder printing quality. In order to ensure product quality and establish proper printing process windows, we discuss the printing technology of solder paste and setting of process parameter, and present relevant improvement measures.
Research and Development of Sn-Zn Lead-free Solder

黎小燕,陈国海,马莒生

DOI: https://doi.org/10.3969/j.issn.1001-3474.2004.04.004

2004-01-01

Abstract:Environment protection has been a part of state sustainable development.As lead pollutes environment and do harm to the health of human and animals,the use of lead solder is limited.It is necessary for the electronic industry to develop a new lead-free solder.Sn-Zn alloy is a candidate for the traditional lead-tin solder substitute.The research of Sn-Zn has been reviewed.The effect of elements in the alloy and the interface between solder and substrate after soldering have mainly been discussed. Some suggestions for improving the performance of Sn-Zn alloy has been presented.
Aluminum Solder Paste and Its Application

何鹏,冯吉才,钱乙余,黄振凤,麦汉辉,刘世胄

DOI: https://doi.org/10.3321/j.issn:1004-0609.2002.06.006

2002-01-01

Abstract:A solder paste used for brazing was developed and its technical performance was investigated. The experimental results show that the spread ability and the clearance fill ability of the solder paste increase with the increase of grain size of Al-Si metal powder. With the precondition of the nicer clearance fill ability of the solder paste, a small amount of flux and bigger grain size of Al-Si are in favor of the reduce of cost. The solder paste was executed with Al-Si eutectic metal power, nocolok brazing flux and organic fibrin binder according to some proportion. Brazing parameters and the optimal composition proportion of the solder paste were decided. The results show that the solder paste take on favorable brazing ability and nicer clearance fill ability.
Investigation Progress on Properties of Sn-Ag-Cu Lead Free Solder Paste

张莎莎,张亦杰,马乃恒,王浩伟

DOI: https://doi.org/10.3969/j.issn.1001-3814.2010.01.039

2010-01-01

Abstract:Sn-Ag-Cu solder systems are one of the most promising lead-free alloys.The studying emphasis,such as melting temperature,wettability,oxidation resistance as well as soldering reliability are summarized in details.Furthermore,the prospects for development of Sn-Ag-Cu solder systems are proposed.
The Development And Trends Of Lead-Free Solders In China

Js Ma

2001-01-01

Abstract:Tin-lead solder alloys have long and widely been used in the electronics industry because of their abundance in natural deposits, low cost, suitable melting points and excellent soldering properties. Practically almost all of the microelectronic assemblies in use today utilize Sn-Pb solders for various interconnection applications. With the advent of chip scale packaging technologies, the usage of soldered connections has increased. But many engineering problems have also been identified with the use of Sn-Pb solders in practice, such as nonwetting, dewetting, bridging. On the other hand, emerging environmental regulations worldwide, most notably in Europe and Japan, have targeted the elimination of Pb usage in the electronic assemblies, due to the inherent toxicity of Pb. It has therefore made the search for suitable "lead-free" solders an important issue in the microelectronics industry. Up to now, approximately 70 lead-free solder alloy compositions have been proposed. There have also been a lot of research activities in China to face the challenges, and this paper is to review the efforts and successes on lead-free solder research with a few selected examples.
Recent Development of Lead-Free Solder in Electronic Packaging

HUANG Zhuo,ZHANG Li-ping,CHEN Qun-xing,TIAN Min-bo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2006.11.004

2006-01-01

Abstract:Along with the issue of WEEE/RoHS, electronic packaging industry raised the furtherrequirement for lead-free jointing. The three substitutes of lead-free solder were brought forwardaccording to the recent research. Three main weaknesses about the lead-free solder being usednowadays were summarized, and a summarization of the advantages and disadvantages about theinternational recommended lead-free solders were made as well.
A New Type Lead-free Solder

陈国海,耿志挺,马莒生,张岳

DOI: https://doi.org/10.3969/j.issn.1001-2028.2003.04.013

2003-01-01

Abstract:The Sn-Pb solder commonly used in electronic industry will be restricted because of the leads toxicity. The study on lead-free solder is becoming a focus. The new solder is an alloy of Sn-Ag-Cu-In-Bi, which exhibit better performance. By a series of properties tests related with melting point, hardness, shear strength, solderability, etc., a optimum formula for Sn-Ag-Cu-In-Bi lead-free solder has been determined.
Prospect of Reflow Soldering Process

史建卫,何鹏,钱乙余,袁和平

DOI: https://doi.org/10.3969/j.issn.1004-4507.2005.01.015

2005-01-01

Abstract:This article expounds the future development of reflow soldering technology according to the changes of technology in SMT.
A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Muhammad Aamir,Riaz Muhammad,Majid Tolouei-Rad,Khaled Giasin,Vadim V. Silberschmidt

DOI: https://doi.org/10.1108/ssmt-11-2018-0046

2019-10-14

Abstract:Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

materials science, multidisciplinary,engineering, electrical & electronic,metallurgy & metallurgical engineering, manufacturing
Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Mu-lan Li,Liang Zhang,Nan Jiang,Lei Zhang,Su-juan Zhong

DOI: https://doi.org/10.1016/j.matdes.2020.109224

2021-01-01

Abstract:<p>As to promote the performance of the solder joints applied to electronics industry, the researchers take advantage of micro/nano-sized particles or another element coated on nanoparticles to be incorporated into the solder paste or flux and investigate their microstructure and properties. Based on refinement strengthening and dispersion strengthening theory, it was reported that introducing nanoparticles into the solder could significantly refine the matrix of the solder, improve the wetting ability and strengthen the mechanical performance of the solder joints. In this review, the influence and mechanism of varying sizes and contents of the metallic particles, intermetallic compound particles, metal oxide particles and carbon nanoparticles on the structure and performance of the solder is comprehensively summed up. Subsequently, the influence of nanoparticles on the melting temperature, wettability, microstructure, mechanical evolution, creep behaviors, electromigration properties and reliability of the solder has been summarized. Furthermore, the effect of micro-sized particles addition to solder alloy in 3D packaging also has been sketched out. Finally, the shortcomings of nanoparticle reinforced lead-free solder are put forward in order to provide a theoretical basis for the future development of particle-reinforced solder with excellent properties.</p>

materials science, multidisciplinary
Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Jie Wu,Song-bai Xue,Jing-wen Wang,Shuang Liu,Yi-long Han,Liu-jue Wang

DOI: https://doi.org/10.1007/s10854-016-5407-3

2016-07-23

Abstract:Sn–Ag–Cu lead-free solders, containing alloy elements and nanoparticles, have been extensively investigated. With the extensive prevalence of 3D IC package, a major concern of Sn–Ag–Cu based solders today is continuously focused on extending service life of solder bonding formed between solders and substrates. The critical issues and improvements on Sn–Ag–Cu solders bearing alloys and nanoparticles are outlined and evaluated in this review. It can be summarized that appropriate content of certain alloys or nanoparticles addition to Sn–Ag–Cu solder is possible to tailor the solder properties, such as the melting and solidification behaviors, oxidation resistance, wettability, (interfacial) microstructure, and mechanical properties. Worthy of note is that reliability issues such as creep behavior, thermomechanical fatigue, electromigration, thermomigration and Sn whisker were briefly discussed and analyzed to lay down a solid foundation for the future development of 3D IC technology.
Lead-free Environment-Friendly Electronic Silver Paste and Preparation Method Thereof

宋锡瑾,王杰,王锦凯

2010-01-01

Abstract:The invention discloses lead-free environment-friendly electronic silver paste, which comprises the following raw materials in percentage by mass: 3-10 percent of inorganic binder, 10-20 percent of self-crosslinking acrylic resin, 65-75 percent of silver powder, 0.5-5 percent of surface modifying agent, 0.5-5 percent of additive and 0.1-0.5 percent of defoaming agent. The invention also discloses a preparation method of the lead-free environment-friendly electronic silver paste, comprising the following steps of: uniformly mixing the silver powder and the inorganic binder; adding the surface modifying agent to be uniformly stirred; adding the self-crosslinking acrylic resin, the addictive and the defoamming agent into the mixture to be ground for 5-8 hours; and filtering to obtain the lead-free environment-friendly electronic silver paste. In the invention, the method for preparing lead-free environment-friendly electronic silver paste has the advantages of no lead, environment protection, simple process, convenient feasibility, no special equipment and small investment, and is convenient to control the product performance.
Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

Shuai Li,Xingxing Wang,Zhongying Liu,Feng Mao,Yongtao Jiu,Jinyong Luo,Linjian Shangguan,Xiangjie Jin,Gang Wan,Shuye Zhang,Peng He,Weimin Long

DOI: https://doi.org/10.1155/2020/8843166

IF: 3.791

2020-01-01

Journal of Nanomaterials

Abstract:With the miniaturization of solder joints and deterioration of serving environment, much effort had been taken to improve the properties of Sn-based lead-free solders. And the fabrication of Sn-based lead-free composite solder alloys by the addition of nanoparticles is one of the effective ways to enhance the properties. In this paper, the recent research progress on the Sn-based lead-free composite solder alloys is reviewed by summarizing the relevant results in representative ones of Sn-Ag-Cu (SAC), Sn-Bi, and other multielement lead-free composite solder alloys. Specifically speaking, the effect of the added nanoparticles on the evolution of wettability, microstructure morphology, and mechanical properties of Sn-based lead-free composite solder alloys are summarized. It is hoped that this paper could supply some beneficial suggestions in developing the novel Sn-based lead-free composite solder alloys. Additionally, the existed issues and future development trends in the exploitation of new novel Sn-based lead-free composite solder alloys are proposed.
The Trend Towards Lead-free in Electronic Packages and Its Choke Point

熊胜虎,黄卓,田民波

DOI: https://doi.org/10.3969/j.issn.1001-2028.2004.03.010

2004-01-01

Abstract:The European Union has passed two prescripts to restrict the use of lead and orther injurant in electronic products. The products containing lead will be eliminated in market soon. Lead-free solder is the key to electronic assembly engineering (lead-free package). Now the research on lead-free solder focuses on two fields: Sn base solder and conductive adhesive. The disadvantages of three typical lead-free solders, and three problems in the conductive adhesive study are discussed. So far, there is no international standard about the use of lead-free solder.
Development and Evaluation of SAC105 Solder Paste

MA Xin,XU Jin-hua,WANG Ling,WANG Hong-qin

DOI: https://doi.org/10.14176/j.issn.1001-3474.2012.06.007

2012-01-01

Abstract:For lead-free electronic assembly,the application of solder alloy with lower silver content is the main tendency in order to improve the ratio of performance to price.SUPER 105 solder paste,which is using SAC105 solder alloy,has been developed.Its performance has been evaluated through the tests on anti-oxidation,surface insulation resistance,printing performance,BGA void and solder joint strength.The results indicate that SUPER105 solder paste is fully applicable for consumer electronic assembly.
J031041 Effect of Flux on the Microwave Reflow of Lead-Free Solder

Hayato YAMAUCHI,Yang JU

DOI: https://doi.org/10.1299/jsmemecj.2011._j031041-1

2011-01-01

Abstract:Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited, since lead may have a bad influence on human and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that of SnPb, which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The results indicate that the flux has the effects to shorten the heating time and control the substrate temperature.
Synthesis and Characterization of Nano-Composite Lead-Free Solder

D. C. Lin,C. Y. Kuo,T. S. Srivatsan,M. Petraroli,G. X. Wang

DOI: https://doi.org/10.4028/www.scientific.net/JMNM.23.145

2005-01-01

Abstract:A series of experiments conducted on a lead-free eutectic solder (Sn-3.5%Ag) have shown that addition of trace amounts of nanometer-sized particles does have an influence on mechanical properties of materials. In this study, three different types of nanoparticles (copper, nickel and iron) were chosen as the reinforcing candidate. For each particulate reinforcement the reflow process was performed under identical cooling conditions. Addition of trace amounts of nano-particles alters the kinetics governing solidification of the composites older paste while concurrently exerting an influence on microstructural development, particularly the formation and presence of second phases in the solidified end product. The nano-sized powder particle-reinforced composite solder revealed an increase in rnicrohardness compared to the unreinforced monolithic counterpart.
Comparison on both the microstructure and mechanical properties of joints soldered by rapidly solidified (RS) solder and solder paste

Le Huang,Xiangyun Tang,Jusheng Ma,Fengqiong Diao,Wuxin Zhang

1995-01-01

Abstract:The microstructure of gold-plating sample soldered by two lead-rich solders (RS solder or solder paste) as well as the mechanical characteristics of joints were compared. The comparison results show that the microstructure of the joints soldered by the RS solder is more homogeneous and finer than the one by solder paste, moreover, its anti-fatigue property is also better than the one by solder paste, hence it has a good prospect for manufacturing of high-reliability products.
Corrosion behavior of Sn-based lead-free solder alloys: a review

Shuai Li,Xingxing Wang,Zhongying Liu,Yongtao Jiu,Shuye Zhang,Jinfeng Geng,Xiaoming Chen,Shengjin Wu,Peng He,Weimin Long

DOI: https://doi.org/10.1007/s10854-020-03540-2

2020-01-01

Abstract:Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn–Bi, Sn–Cu, Sn–Zn, Sn–Ag, Sn–Ag–Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.
Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application

B. Senthil Kumar,Zhang Rui Fen,Yam,Lip Huei,Zhang HanWen,Kang Sungsig,Chan Li-San

DOI: https://doi.org/10.4071/1085-8024-2021.1.000239

2021-10-01

International Symposium on Microelectronics

Abstract:Abstract The ultra-fine SAC305 solder is widely used as the lead-free solder composition for interconnection in advanced packaging based on its advantages such as good joint strength, thermo-mechanical fatigue behavior and creep resistance. Stencil printing remains the technology of choice for system-in-package (SiP) assembly because of its benefits such as economy of usage, ease of process control, flexibility of usage and fast and wide range of process window. SiP involves the high-level integration of different components, Copper (Cu) pillar flip-chip dies and chips in one package to achieve multiple functions in one system. The need to accommodate ever increasing demand for reduced footprints requires the technology to constantly invent a range of Cu pillar 55μm diameter and smaller components. Many mobile communications SiP consist of 6 or more flip chips in a single package. Conventional flip-chip attach uses flux & Cu pillar solder cap for solder joint formation as it is challenging for solder paste to be printed on fine geometries below 70μm. Additional benefits of solder paste printing help eliminate non-wet Cu pillar defect rates and improve yield over conventional flux printing. Heraeus solder paste (AP series T7) makes use of ultra-fine spherical shape of solder powder to create strong metal coalesce for bonding during reflow process of Cu pillars mounting to substrates. For example, the smallest passive component in use today is 008004 and Cu pillar diameter of 70um, which has a stencil opening of 125μm and 70μm respectively. Further reduction in Cu pillar flip-chip diameter of 55μm will require further reduction in stencil opening to 55μm, thus testing the limits of current type 7 pastes. Current solder pastes (AP series T7) can meet the consistency of printability when the stencil opening is 70μm or more. With smaller stencil opening, down to 55μm, the printing performance is less than desired. In this paper we describe the stencil printing application on the enhanced version of type 7 paste with a reinvented flux. The application tests were carried out using 55μm stencil opening. This paper will report the results of this application test.

A New Solder Technology: Rinse-free Flux and Lead-free Solder Tin Paste

Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology

Research and Development of Sn-Zn Lead-free Solder

Aluminum Solder Paste and Its Application

Investigation Progress on Properties of Sn-Ag-Cu Lead Free Solder Paste

The Development And Trends Of Lead-Free Solders In China

Recent Development of Lead-Free Solder in Electronic Packaging

A New Type Lead-free Solder

Prospect of Reflow Soldering Process

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review

Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging

Lead-free Environment-Friendly Electronic Silver Paste and Preparation Method Thereof

Research Status of Evolution of Microstructure and Properties of Sn-Based Lead-Free Composite Solder Alloys

The Trend Towards Lead-free in Electronic Packages and Its Choke Point

Development and Evaluation of SAC105 Solder Paste

J031041 Effect of Flux on the Microwave Reflow of Lead-Free Solder

Synthesis and Characterization of Nano-Composite Lead-Free Solder

Comparison on both the microstructure and mechanical properties of joints soldered by rapidly solidified (RS) solder and solder paste

Corrosion behavior of Sn-based lead-free solder alloys: a review

Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application