Development and Evaluation of SAC105 Solder Paste

MA Xin,XU Jin-hua,WANG Ling,WANG Hong-qin

DOI: https://doi.org/10.14176/j.issn.1001-3474.2012.06.007

2012-01-01

Abstract:For lead-free electronic assembly,the application of solder alloy with lower silver content is the main tendency in order to improve the ratio of performance to price.SUPER 105 solder paste,which is using SAC105 solder alloy,has been developed.Its performance has been evaluated through the tests on anti-oxidation,surface insulation resistance,printing performance,BGA void and solder joint strength.The results indicate that SUPER105 solder paste is fully applicable for consumer electronic assembly.