Prospect of Reflow Soldering Process

史建卫,何鹏,钱乙余,袁和平

DOI: https://doi.org/10.3969/j.issn.1004-4507.2005.01.015

2005-01-01

Abstract:This article expounds the future development of reflow soldering technology according to the changes of technology in SMT.

What problem does this paper attempt to address?

RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY

tian yanhong,wang chunqing

DOI: https://doi.org/10.3969/j.issn.1001-1382.2002.06.002

2002-01-01

Abstract:Development of advanced electronic package devices promoted the study on the reflow soldering. In this paper, development of electronic packages was described briefly first, then the most popular reflow soldering methods were discussed. A potential reflow method-laser reflow soldering was expatiated in detail.
A New Solder Technology: Rinse-free Flux and Lead-free Solder Tin Paste

卢云,杨邦朝,冯哲圣

DOI: https://doi.org/10.3969/j.issn.1001-2028.2002.10.011

2002-01-01

Abstract:Rinse-free flux and lead-free tin solder paste are discussed, including their development, performances, features and existing problems. The research on and the application in the electronic assembly technology of the two materials are reviewed.
Reflow of Lead-Free Solder by Microwave Heating

Yang Ju,Hayato Yamauchi,Hiroki Oshima,Kensuke Tanaka

DOI: https://doi.org/10.1504/ijmsi.2014.064771

2014-01-01

International Journal of Materials and Structural Integrity

Abstract:Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited since lead may have a bad influence on humans and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that for SnPb which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The microwave heating system worked at 2.45 GHz frequency on TE10 mode. The most suitable heating location in the waveguide and the most suitable microwave power were investigated by measuring the temperature of the substrate and the solder simultaneously. After the solder was heated up to the melting point of 493 K, solder-mounted was achieved. The intermetallic chemical compound between the solder and Cu was observed by SEM and it was also analysed by the cross-section of the solder using EDX.
A Reflow Soldering Retro-Design System for Rework Station Based on Q-factor

XJ Sheng,H Ding,YH Yin,YP Wu

DOI: https://doi.org/10.1109/agec.2005.1452315

2004-01-01

Abstract:Currently reflow soldering is the primary process used for the assembly of PCB. We now have finite difference (FD) and computational fluid dynamics (CFD) modeling tools, which can establish the reflow soldering process models and compute out the detailed representations of the real reflow ovens. This paper presents the development of a reflow soldering retro-design system for rework stations with the above modeling tools. Heating factor (Q-factor) is used to evaluate whether the achieved profile fulfils the soldering task well despite the real curve different from the ideal one. The behavior of adjusting the heat profile to make the feature points meet the requirements of components and solders computationally may then get the optimal profile without any actual reflow running. Meanwhile, the system introduces the closed-loop implementation of process recipe on the device controller so as to enhance the execution repeatability. This system is used to set the bottom and top heater profiles of a Metcal APR-5000 rework station.
On reflow soldering process and reflow profile

Xulong Gu,Zongyang Zhang,Ling Xu,Sheng Liu,Xulong Gui

DOI: https://doi.org/10.1109/icept-hdp.2012.6474748

2012-08-01

Abstract:In order to obtain good welding quality, some influencing factors of reflow soldering process were studied in this research. A series of welding experiments were conducted in a small reflow soldering oven. Oxidation and surface treatment of soldering materials are important factors in the welding process. Temperature curve of reflow soldering has a great influence on the welding quality, and the welding effects under temperature profile of the ramp-soak-spike (RSS) and ramp-to-spike (RTS) were compared. The microstructure of the solder joints and the intermetallic compound were observed by electron microscopy. The tensile tests were used to measure the mechanical properties of solder joints. A SAM machine was used to evaluate the voiding ratio of welding interface layer. Some results were obtained. Some expired solders and oxidized copper were used for comparison study. There were gas cavities existing in the inner metal interface layer, and the gas cavities were hard to be eliminated by the common reflow soldering. It was also found that the reflow of solder paste was not very good under the RTS curve, comparing to the typical temperature curve. All these welding experiments demonstrated that the reflow soldering process and reflow profile have a relatively large impact on welded results.
J031041 Effect of Flux on the Microwave Reflow of Lead-Free Solder

Hayato YAMAUCHI,Yang JU

DOI: https://doi.org/10.1299/jsmemecj.2011._j031041-1

2011-01-01

Abstract:Recently, the use of solder containing lead in the interconnection between printed substrate and electric packages has been prohibited, since lead may have a bad influence on human and the environment. Today Sn-Ag-Cu alloys (SnAgCu) are used in general as a substitute of Sn-Pb alloys (SnPb). However, the melting point of SnAgCu is higher than that of SnPb, which may induce damages in the substrate and packages. To solve this problem, the reflow of lead-free solder by microwave heating was studied. The results indicate that the flux has the effects to shorten the heating time and control the substrate temperature.
Influence of Reflow Atmosphere on SAC305 Solder Joints

Yanting Zhou,Dongyan Ding,Bai Han,Yunhong Yu,Xulin Sun,Henri Chevrel,Hua Ying,Ming Li,Dali Mao

DOI: https://doi.org/10.1109/isapm.2011.6105701

2011-01-01

Abstract:Electronic assembly technology is in the transition from traditional tin-lead to lead-free. In comparison with Sn-Pb solders, high melting point and poor wettability of the lead-free solders lead to great challenge to present electronic assembly technologies. Inert nitrogen atmosphere can both widen the process window of reflow and improve the mechanical reliability of solder joints. The focus of this study is to investigate the effect of reflow atmosphere on the reflow process and solder joint reliability of lead-free solders (SAC305). Board level reflow in various kinds of atmospheres and microstructural characterization of the solder joint were carried out to demonstrate the influence of controllable atmosphere on the reflow quality of the lead-free solder joints. The SAC305 solder joint fabricated in 1000 ppm O 2 exhibited a good surface morphology and an interface with very small pores. Surface finish of the solder pad was found to have a great influence on the as-reflowed solder joints.
Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology

SHI Jian-wei,HE peng,QIAN Yi-yu,YUAN He-ping

DOI: https://doi.org/10.3969/j.issn.1004-4507.2006.12.007

2006-01-01

Abstract:With higher density assembly and smaller devices, fine pitch leader requires perfect solder printing quality. In order to ensure product quality and establish proper printing process windows, we discuss the printing technology of solder paste and setting of process parameter, and present relevant improvement measures.
Research and Development of Sn-Zn Lead-free Solder

黎小燕,陈国海,马莒生

DOI: https://doi.org/10.3969/j.issn.1001-3474.2004.04.004

2004-01-01

Abstract:Environment protection has been a part of state sustainable development.As lead pollutes environment and do harm to the health of human and animals,the use of lead solder is limited.It is necessary for the electronic industry to develop a new lead-free solder.Sn-Zn alloy is a candidate for the traditional lead-tin solder substitute.The research of Sn-Zn has been reviewed.The effect of elements in the alloy and the interface between solder and substrate after soldering have mainly been discussed. Some suggestions for improving the performance of Sn-Zn alloy has been presented.
Test And Assessment Of The Heating System Of Reflow Ovens

Yuming Wang,Zengwei Cui,Beibei Wang

DOI: https://doi.org/10.1109/ICEPT.2010.5582693

2010-01-01

Abstract:As the point interconnects between printed circuit board (PCB) and chips and owning a soft constitutive material property, solder joint interconnect is the crucial link for reliability of electronic systems. The behaviour and quality of solder joints are determined by solder material, geometry design and reflowing operation processed by reflow ovens. Reflow oven is thus the most important means in PCB soldering and its performance directly concerns the behaviour and reliability of electronic systems.Until now there was no unified standard of evaluation and acceptance for reflow oven in China domestic market. The existed are all laid down by different equipment manufacturers, which makes confused and blinded situation for customer acceptance. This situation has heavily affected the quality of solder joints. There is an urgent need to carry out relevant research for formulating uniform inspection subjects, inspection standards, inspection tools and inspection processes.This paper reports our work on testing, assessment and research of the heating system of reflow ovens. This is a systematic study of testing process, including building testing equipment, setting up testing curve, measuring temperature field and assessing reflow ovens. Using the method suggested in the current paper, various performance parameters of the heating system can be obtained. The performance of reflow oven and behaviour of soldering joints can be predicted. The result and method are relevant to enhancement of manufacturing quality and selection of appropriate ovens. This may also set a basis for setting up relevant standards for regularity of the manufacturing and assessment of reflow ovens. This paper is concerned with the first step of a whole systematic project. Other results will be reported in due course.
Influence of Argon Reflow on the Microstructure and Properties of Lead-Free Solder Joints

Yeqing Tao,Jason Guo,Dongyan Ding,Ting Li,Yunhong Yu

DOI: https://doi.org/10.1109/icept.2015.7236615

2015-01-01

Abstract:With human's increasing attention to the environment protection, the transition of electronic assembly technology from tin-lead to lead-free is a matter of necessity. Sn-Ag-Cu solder alloy systems have been considered as the most potential substitute for traditional Sn-Pb solder alloys. It has been accepted that, in protective atmosphere, the peak reflow temperature can be reduced and the wetting performance of lead-free solder joints can be improved. Ar is the most plentiful rare inert gas. To date, however, few researches on using Ar as reflow atmosphere have been reported. The focus of this study is to investigate the influence of Ar reflow atmosphere on the microstructure and properties of lead-free solder joints. Reflow process in Ar atmosphere was conducted for OSP-pad PCBs. Board level reflow in different atmospheres and microstructural characterization of the solder joints after both reflow process and environmental tests were carried out. The experimental results indicated that Ar atmosphere could obviously improve the wetting performance and reliability of solder joints in comparison with the solder joints fabricated in air atmosphere.
Experimental Research on Reliability of Reflowed Through-Hole Solder Joints

Y Ding,CQ Wang,YH Tian

DOI: https://doi.org/10.1109/eptc.2003.1298764

2003-01-01

Abstract:An analysis on reliability of through hole solder joints under thermal shock was carried out in this paper. Compared with the traditional wave soldered joints, the response of reflow soldered joints to the thermal fatigue test were studied in non-destructive and destructive ways. Cracks were caused in solder joints by the coefficient of thermal expansion (CTE) mismatch. And the cracking extent in the reflow soldered joints were dissimilar to that in the wave soldered joints due to the difference of solder joint shape. Furthermore, the failure mechanics of solder joints were analyzed thoroughly.
Research progress on solder thermal interface materials

Jiang Yang,Zou Guisheng,Du Chengjie,Liu Lei

DOI: https://doi.org/10.12073/j.cw.20211216001

2022-01-01

Abstract:Down to the road of miniaturization and high power density, the heat dissipation is becoming one of the critical factors restrict-ing further development of advanced microelectronic devices. Traditional polymer-based thermal interface materials (TIMs) are not compet-itive for the high efficiency thermal management, mainly due to their low intrinsic thermal conductivity and high interface thermal resist-ance. Solder-based TIM is one of the best candidates for the next generation of thermal interface materials. This paper conducts a perspect-ive review of the state of the art of solder TIM, including low melting alloy solder TIM, composite solder TIM and nanostructured solder TIM. The microstructure, process parameters, thermal performance and reliability of different TIMs are summarized and analyzed. The fu-ture trends of advanced TIMs are discussed.
Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications

István Bozsóki,Attila Géczy,Balázs Illés

DOI: https://doi.org/10.3390/en16165856

IF: 3.2

2023-08-09

Energies

Abstract:This paper gives a review of different applications in the numerical modelling of reflow soldering technology from recent years. The focus was on detailing the different process types, the physical background, and related mathematical models. Reflow soldering is the main connection technology of surface mounting. Firstly, the solder in paste form is stencil-printed onto the solder pads of the applied substrate, and then surface mounted devices are placed onto the solder deposits. Finally, the whole assembly is heated over the melting temperature of the solder alloy, which melts and forms solder joints. Surface mounting technology needs a low defect rate which is determined by process parameters, material properties, and the printed circuit board design. Accompanying the experiment and measurement, the identification and elimination of root causes can be effectively improved with numerical modelling, which also grants details to such physical mechanisms that are not even conventionally measurable. This paper is dealing with the following topics from the modelling point of view: an introduction of the different reflow technologies; a brief introduction of primary partial differential equations and calculation procedures; heat transfer mechanisms and thermomechanical stresses; and a brief summary of the results of selected studies. A short overview is also given about soft computing methods applied in reflow process optimisation.

energy & fuels
The survey of key technologies of SMT

罗磊,王石刚,蔡建国

DOI: https://doi.org/10.3969/j.issn.1001-2265.2003.02.002

2003-01-01

Abstract:By analyzing the state-of-the-art key technologies of SMT, the authors summarize the key elements of SMT in this paper. It is proposed that the requirements of the SMT, namely high speed, high precision, intelligence and flexibility can be met by establishing intelligent control architecture and control methods. The authors also put forward the architecture for surface mount devices which is characterized as modules combined, functions separated, open system architecture and highly efficient flexible. Theoretical and practical data to be used in the RD of the equipments can be obtained via further research about the key technologies.
Controlling And Optimization Of Thermal Profile In Reflow Soldering

Jianwei Shi,Peng He,Xiaochun Lv

DOI: https://doi.org/10.1142/S0217979209061883

2009-01-01

International Journal of Modern Physics B

Abstract:Heating factor, Q is a quantitative parameter describing a process of reflow soldering. It can be used to evaluate a reflow soldering process and the reliability of solder joints. The value of Q is directly related to the energy absorbed by solder joint during heating and the morphology of Intermetallic Compound formed at the interface between solder and pad. Electronic product manufacturers use heating factor as a technical evaluation parameter to guide the adjustment of reflow soldering process and the optimization of reflow soldering curve, to ensure the best reliability of the circuit board. Solder paste manufacturers use heating factor to represent characteristics of their reflow soldering products, and to customize products according to consumer's requests. Equipment manufacturers for reflow soldering use heating factor as an important controlling parameter to establish automatic system for managing solder joint reliability. A reliable soldering result can be achieved using the automatic reflow management system, to control and optimize thermal profile, which leads to the adjustment of the heating factor.
SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

Jiayun Feng,Di Erick Xu,Yanhong Tian,Michael Mayer

DOI: https://doi.org/10.1109/tcpmt.2019.2901651

2019-01-01

IEEE Transactions on Components Packaging and Manufacturing Technology

Abstract:The proper control of solder heating and melting leads to successful joining of surface-mount technology devices to the metallization of printed circuit boards. When developing new solder alloys for more miniaturized and lower temperature processes, the improved process control for the heating and melting during solder reflow can be beneficial. To find an optimized temperature profile efficiently, it is helpful to know the exact onset times of the physical mechanisms of soldering including sintering, melting, and solidification. In particular, to exactly know the time, the solder remains in the molten state can help to minimize the temperature exposure of sensitive substrates. To this end, we used standard lead-free SAC305 solder and a real-time resistance monitoring setup to observe the in-process resistance during the soldering of a 0805-type chip resistor to find out exact points in time when the soldering mechanisms occur. Cross-sectioning studies and microscopic observations were performed in parallel to explain three distinct resistance drops observed in the resistance signals. Sintering of solder balls resulted in drop 1, the collapse and melting of all the solder balls resulted in drop 2, and the solidification of solder resulted in drop 3, which actually consisted of two separate drops, one for each solder joint of the chip resistor. The observation of the resistance drop due to solder solidification was achieved because our newly improved setup reduced the signal noise to less than 0.012 m Omega (root mean square value). On average, the solder was in a liquid state for 17.6 min +/- 0.18 min (seven samples). The solidification drop was 0.2 m Omega and happened at approximately 200 degrees C, indicating not more than 28 K of undercooling. Such an accurate measurement of melting and solidification times may prove useful in the future when optimizing the reflow temperature profiles for advanced soldering applications, e.g., to minimize the melting-solidification interval on heat-sensitive thin flexible substrates for wearables.
Effect of Atmosphere on the Lead-free Reflow

Dali Mao

2012-01-01

Abstract:The transition from traditional tin-lead to lead-free has brought great challenge to present electronic assembly technology.The effect of reflow atmosphere on lead-free reflow process is introduced.Compared with Sn-Pb eutectic solder,lead-free solders have a high melting point and poor wettability.It has been reported in recent years that soldering in inerting gas of nitrogen can widen the reflow process window,improve the wettability,reduce soldering temperature and improve the reliability of solder joints.Furthermore,reducing atmosphere such as hydrogen atmosphere could also improve the reflow quality of the solder joints.
Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

Yongze Xu,Yu Liu,Lei Zhang

DOI: https://doi.org/10.1155/2021/9955967

IF: 1.4

2021-06-16

Discrete Dynamics in Nature and Society

Abstract:In this study, a heat convection model of the reflow oven and a heat conduction model of the soldering area are proposed based on heat transfer theory, and a dynamic Thomas algorithm is developed for solving linear equations with coefficient matrix evolving over time in the tridiagonal system, which is derived from a heat transfer problem with moving boundaries in the solder phase transition process. We have also carried out numerical simulations for investigating the accuracy of the mathematical model, in which the temperature profiles are calculated and compared for different cases with considering or ignoring phase transformations, respectively. Parameters of reflow soldering, such as the conveyor speed, the set temperature in each zone, and a part of the heating factor, are optimized by the use of the nondominated sorting genetic algorithm II. By comparing the temperature profile and optimal solutions in the two cases, numerical results show that phase transitions of the solder have great impacts on optimal parameters and the slope of temperature profiles. Moreover, the phenomenon that the heating factor varies with the maximum set temperature in a banded distribution is investigated and analyzed, which is an important part of this work.

mathematics, interdisciplinary applications,multidisciplinary sciences
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance

Bingyi Li,Songtao Qu,Gong Zhang

DOI: https://doi.org/10.1108/ssmt-02-2024-0006

IF: 1.494

2024-04-17

Soldering & Surface Mount Technology

Abstract:Purpose This study aims to focus on the surface mount technology (SMT) mass production process of Sn-9Zn-2.5Bi-1.5In solder. It explores it with some components that will provide theoretical support for the industrial SMT application of Sn-Zn solder. Design/methodology/approach This study evaluates the properties of solder pastes and selects a more appropriate reflow parameter by comparing the microstructure of solder joints with different reflow soldering profile parameters. The aim is to provide an economical and reliable process for SMT production in the industry. Findings Solder paste wettability and solder ball testing in a nitrogen environment with an oxygen content of 3,000 ppm meet the requirements of industrial production. The printing performance of the solder paste is good and can achieve a printing rate of 100–160 mm/s. When soldering with a traditional stepped reflow soldering profile, air bubbles are generated on the surface of the solder joint, and there are many voids and defects in the solder joint. A linear reflow soldering profile reduces the residence time below the melting point of the solder paste (approximately 110 s). This reduces the time the zinc is oxidized, reducing solder joint defects. The joint strength of tin-zinc joints soldered with the optimized reflow parameters is close to that of Sn-58Bi and SAC305, with high joint strength. Originality/value This study attempts to industrialize the application of Sn-Zn solder and solves the problem that Sn-Zn solder paste is prone to be oxidized in the application and obtains the SMT process parameters suitable for Sn-9Zn-2.5Bi-1.5In solder.

materials science, multidisciplinary,engineering, electrical & electronic,metallurgy & metallurgical engineering, manufacturing

Prospect of Reflow Soldering Process

RESEARCH STATUS OF REFLOW SOLDERING TECHNOLOGY IN MICROELECTRONIC PACKAGING AND ASSEMBLY

A New Solder Technology: Rinse-free Flux and Lead-free Solder Tin Paste

Reflow of Lead-Free Solder by Microwave Heating

A Reflow Soldering Retro-Design System for Rework Station Based on Q-factor

On reflow soldering process and reflow profile

J031041 Effect of Flux on the Microwave Reflow of Lead-Free Solder

Influence of Reflow Atmosphere on SAC305 Solder Joints

Press Technology of Solder Paste and Change of Process Parameter in Lead-free Technology

Research and Development of Sn-Zn Lead-free Solder

Test And Assessment Of The Heating System Of Reflow Ovens

Influence of Argon Reflow on the Microstructure and Properties of Lead-Free Solder Joints

Experimental Research on Reliability of Reflowed Through-Hole Solder Joints

Research progress on solder thermal interface materials

Overview of Different Approaches in Numerical Modelling of Reflow Soldering Applications

The survey of key technologies of SMT

Controlling And Optimization Of Thermal Profile In Reflow Soldering

SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring

Effect of Atmosphere on the Lead-free Reflow

Effects of the Solder Phase Transformation on the Optimization of Reflow Soldering Parameters and Temperature Profiles

The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance