Prediction of Thermal Strain in Diamond-Zinc Sulfide Composite Infrared Windows

张继华,孙亦宁,李敬起,高欣,郭晚土,王曦
DOI: https://doi.org/10.3969/j.issn.1007-4252.2002.04.011
2002-01-01
Abstract:Considering the reliability of diamond/ZnS infrared windows, it is v ery useful to know how much thermal stress and deflection exist in the structure.The stresses, curvat ure and deflection of thickdiamond film bonded to zinc sulfide substrate at elevated temperature were pre dicted. An elastic strain numerical model was used in the calculation.The thermal stresses throughout th e structure after bonding were shown for each condition. Also, the curvature and the edge to center defl ection caused by thermalstresses were reported. Results show that when thickness ratio of diamond film s to ZnS is about 17%and bonding temperature is higher than 250oC, the stresses within the ZnS subs trate are predicted to exceed their rupture strength.
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