Abstract:With the miniaturization and multi-functionalization of electronic devices, a large number of electronic components with various requirements on the interconnections and packaging need to be integrated on one substrate. There are specific cases when it is necessary to use a series of solders with the melting points in a wide range. The repetitive and lengthy heating in the sequential reflow soldering leads to the overgrowth of the brittle intermetallic compound at the interface and inevitable thermal damage to the substrates. The high density in energy input and the small heat affected area enable laser soldering to make reliable interconnections using solders with different melting points on the same substrate. And the laser with a wavelength in the visible range can further improve the energy absorption of the solders. In this paper, experiments were carried out by both the laser soldering and the infrared reflow soldering on the tinned copper pads using Sn-based solders with the melting point ranging from 96 to 309 degrees C. A continuous wave solid-state laser with a wavelength of 532 nm and a relatively low power of 1.8 W was applied to all the samples. The wettability of solders, the mechanical properties and the microstructures of the joints were investigated. With better wettability induced by high superheating, reliable joints using solders with significantly different melting points on one substrate have been successfully achieved by the laser. When using Sn16-Pb32-Bi52, Sn42-Bi58 and Sn10-Pb88-Ag2, refined microstructure in the solder bumps resulted in the improved mechanical properties of the laser soldered joints. The fast cooling rate in the laser soldering lead to the non-equilibrium solidification in the eutectic Sn63-Pb37. The increase in the precipitation of Pb-rich phases gave rise to a slight decrease in the shear strength of laser soldered joints.

Effects of Laser and Infrared Secondary Reflow on Microstructure of 63sn37pb/pad Interface

Evolution Of Intermetallic Compounds At Interface Between Pbga Solder Ball And Pads During Laser Reflow Soldering

Interfacial Reaction Between Pbga Solder Ball and Au/Ni/Cu Pad During Laser Reflow

Reaction Kinetics Between SnPb Eutectic Solder and Au/Ni/Cu Pad During Laser Reflow

Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Intermetallic Compounds Formation at Interface Between Pbga Solder Ball and Au/Ni/Cu/Bt Pcb Substrate after Laser Reflow Processes

Interface Reaction of Solder Droplet/pad and Intermetallic Compounds Evolution During Reflow Soldering

The Effects of Laser Reflow Conditions on the Formation of Intermetallic Compounds at Sn3.0ag0.5cu Solder/Cu Joint Interface

Effect Of Laser Input Energy On Wetting Areas Of Solder And Formation Of Intermetallic Compounds At Sn-3.5ag-0.75cu/Au Right-Angled Joint Interface

Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering

Interfacial reaction between PBGA solder balls and Au / Ni /Cu pad during laser reflow bumping

Effect of Laser Input Energy on AuSnx Intermetallic Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads

Laser Soldering of Sn-based Solders with Different Melting Points

Interaction Kinetics Between Pbga Solder Balls and Au/Ni/Cu Metallisation During Laser Reflow Bumping

Study on Laser and Hot Air Reflow Soldering of PBGA Solder Ball

Effect of Protection Atmosphere's Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-Solder Joints

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

SELF EXCITE REFLOWING AND INTERFACIAL REACTION OF SnPb EUTECTIC SOLDER ON BGA PAD UNDER ALTERNATE ELECTRO- MAGNETIC RADIATION

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process

Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints During Isothermal Aging Process

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering