Abstract:With the miniaturization and multi-functionalization of electronic devices, a large number of electronic components with various requirements on the interconnections and packaging need to be integrated on one substrate. There are specific cases when it is necessary to use a series of solders with the melting points in a wide range. The repetitive and lengthy heating in the sequential reflow soldering leads to the overgrowth of the brittle intermetallic compound at the interface and inevitable thermal damage to the substrates. The high density in energy input and the small heat affected area enable laser soldering to make reliable interconnections using solders with different melting points on the same substrate. And the laser with a wavelength in the visible range can further improve the energy absorption of the solders. In this paper, experiments were carried out by both the laser soldering and the infrared reflow soldering on the tinned copper pads using Sn-based solders with the melting point ranging from 96 to 309 degrees C. A continuous wave solid-state laser with a wavelength of 532 nm and a relatively low power of 1.8 W was applied to all the samples. The wettability of solders, the mechanical properties and the microstructures of the joints were investigated. With better wettability induced by high superheating, reliable joints using solders with significantly different melting points on one substrate have been successfully achieved by the laser. When using Sn16-Pb32-Bi52, Sn42-Bi58 and Sn10-Pb88-Ag2, refined microstructure in the solder bumps resulted in the improved mechanical properties of the laser soldered joints. The fast cooling rate in the laser soldering lead to the non-equilibrium solidification in the eutectic Sn63-Pb37. The increase in the precipitation of Pb-rich phases gave rise to a slight decrease in the shear strength of laser soldered joints.

Effect of Protection Atmosphere's Temperature on Morphology of Au-Sn IMCs in Laser Reflowed Micro-Solder Joints

Oxidation and Au‐Sn Reaction of Laser Reflowed Micro‐solder Joints Protected by N2 or Exposed to Air Atmosphere

Effect of Laser Input Energy on AuSnx Intermetallic Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads

Evolution of AuSnx Intermetallic Components in Laser Reflowed Right-angled Solder Joints During Isothermal Aging Process

Comparison of AuSnx IMCs's Morphology, Distribution in Lead-free Solder Joints Fabricated by Laser and Hot Air Reflow Process

Effect of Au-Sn IMCs’ formation and morphologies on shear properties of laser reflowed micro-solder joints

Formation of AuSn X IMCs in Sn3.5Ag0.75Cu Micro-Solder Joints Fabricated by Laser and Hot Air Reflow Processes

Effect Of Laser Input Energy On Wetting Areas Of Solder And Formation Of Intermetallic Compounds At Sn-3.5ag-0.75cu/Au Right-Angled Joint Interface

Effect of Cu addition in Sn-containing solder joints on interfacial reactions with Au foils

Intermetallic Compounds Formation at Interface Between Pbga Solder Ball and Au/Ni/Cu/Bt Pcb Substrate after Laser Reflow Processes

Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Evolution Of Intermetallic Compounds At Interface Between Pbga Solder Ball And Pads During Laser Reflow Soldering

The Effects of Laser Reflow Conditions on the Formation of Intermetallic Compounds at Sn3.0ag0.5cu Solder/Cu Joint Interface

Effects of Solder Volume on Formation and Redeposition of Au-Containing Intermetallics in Ni/Au-SnAgCu-Ni(P) Solder Joints

Effect of Zn Addition in Sn-rich Alloys on Interfacial Reaction with Au Foils

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process

The Effect of Ag3Sn and Cu3Sn Nanoparticles on the IMC Morphology of Sn-3.0Ag-0.5Cu Solder

Laser Soldering of Sn-based Solders with Different Melting Points

Cross-Interaction of Interfacial Reactions in Ni (Au/ni/cu)-Snag-cu Solder Joints During Reflow Soldering and Thermal Aging

Effects of Soldering Temperature on IMCs Formation between Sn-0.7Cu Solder and Cu Substrate

Influence of Thermal Cycling on the Microstructure and Shear Strength of Sn3.5ag0.75cu and Sn63pb37 Solder Joints on Au/Ni Metallization