Abstract:Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutectic Pb-Sn solder-balls were reflowed on the Au/Ni/Cu pads, and the chemical interactions between the solder and the surface finish were studied. Quenched-in microstructures at different stages of the reflow were carefully examined using the scanning electron microscopy. It was found that the solder melted locally along the solder/pad interface at the very early stages of the reflow before the whole solder ball had reached the Pb–Sn eutectic temperature. This was because a ternary eutectic reaction L = (Pb) + (Sn) + AuSn4 occurred at 177°C, six degrees below the Pb–Sn eutectic temperature. Four distinct stages were identified for the reflow process. The four stages are: 1)partial melting of solder balls and the initial reaction of Au with Sn; 2)complete reaction of Au with Sn; 3)separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; 4)complete melting of solder balls and the reaction of Ni with Sn. After a typical reflow, with a 225°C peak reflow temperature and 115s reflow time, all the Au and Au-bearing intermetallic compounds left the interface and the only intermetallic compound at the interface was Ni3Sn4 with a thickness of about 2$\mu$m. partial melting of solder balls and the initial reaction of Au with Sn; complete reaction of Au with Sn; separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; complete melting of solder balls and the reaction of Ni with Sn.

Interfacial reaction between PBGA solder balls and Au / Ni /Cu pad during laser reflow bumping

Interaction Kinetics Between Pbga Solder Balls and Au/Ni/Cu Metallisation During Laser Reflow Bumping

Interfacial Reaction Between Pbga Solder Ball and Au/Ni/Cu Pad During Laser Reflow

Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

Reaction Kinetics Between SnPb Eutectic Solder and Au/Ni/Cu Pad During Laser Reflow

Evolution Of Intermetallic Compounds At Interface Between Pbga Solder Ball And Pads During Laser Reflow Soldering

Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering

Intermetallic Compounds Formation at Interface Between Pbga Solder Ball and Au/Ni/Cu/Bt Pcb Substrate after Laser Reflow Processes

Interface Reaction of Solder Droplet/pad and Intermetallic Compounds Evolution During Reflow Soldering

Investigation of Interfacial Reaction Between Eutectic Sn–Pb Solder Droplet and Au/Ni/Cu Pad

Characteristics of Interfacial Microstructure of PBGA Solder Bump During Multi-Reflow and Aging Processes

Study on Laser and Hot Air Reflow Soldering of PBGA Solder Ball

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Effect of Laser Input Energy on AuSnx Intermetallic Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads

Effect Of Laser Input Energy On Wetting Areas Of Solder And Formation Of Intermetallic Compounds At Sn-3.5ag-0.75cu/Au Right-Angled Joint Interface

Effects of Laser and Infrared Secondary Reflow on Microstructure of 63sn37pb/pad Interface

SELF EXCITE REFLOWING AND INTERFACIAL REACTION OF SnPb EUTECTIC SOLDER ON BGA PAD UNDER ALTERNATE ELECTRO- MAGNETIC RADIATION

The Effects of Laser Reflow Conditions on the Formation of Intermetallic Compounds at Sn3.0ag0.5cu Solder/Cu Joint Interface

The Evolution of Interfacial Microstructure of Sn3.5Ag Solder Bump with Cu Under-Bump Metallization

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process