Abstract:Gold over Ni is one of the most common surface finishes for Cu soldering pads in ball-grid-array (BGA) and other electronic packages. The Au layer is for oxidation protection, and the Ni layer serves as a solderable diffusion barrier. In this study, eutectic Pb-Sn solder-balls were reflowed on the Au/Ni/Cu pads, and the chemical interactions between the solder and the surface finish were studied. Quenched-in microstructures at different stages of the reflow were carefully examined using the scanning electron microscopy. It was found that the solder melted locally along the solder/pad interface at the very early stages of the reflow before the whole solder ball had reached the Pb–Sn eutectic temperature. This was because a ternary eutectic reaction L = (Pb) + (Sn) + AuSn4 occurred at 177°C, six degrees below the Pb–Sn eutectic temperature. Four distinct stages were identified for the reflow process. The four stages are: 1)partial melting of solder balls and the initial reaction of Au with Sn; 2)complete reaction of Au with Sn; 3)separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; 4)complete melting of solder balls and the reaction of Ni with Sn. After a typical reflow, with a 225°C peak reflow temperature and 115s reflow time, all the Au and Au-bearing intermetallic compounds left the interface and the only intermetallic compound at the interface was Ni3Sn4 with a thickness of about 2$\mu$m. partial melting of solder balls and the initial reaction of Au with Sn; complete reaction of Au with Sn; separation of (Au${}_{x}$Ni${}_{1-x}$)Sn${}_{4}$ from the pad; complete melting of solder balls and the reaction of Ni with Sn.

Interface Reaction of Solder Droplet/pad and Intermetallic Compounds Evolution During Reflow Soldering

Reaction Kinetics Between SnPb Eutectic Solder and Au/Ni/Cu Pad During Laser Reflow

Investigation of Interfacial Reaction Between Eutectic Sn–Pb Solder Droplet and Au/Ni/Cu Pad

Evolution Of Intermetallic Compounds At Interface Between Pbga Solder Ball And Pads During Laser Reflow Soldering

Interfacial reaction between PBGA solder balls and Au / Ni /Cu pad during laser reflow bumping

Interfacial Reaction Between Pbga Solder Ball and Au/Ni/Cu Pad During Laser Reflow

Interfacial Reaction between Lead-free Solder Ball and Au/Ni/Cu Pad during Laser Reflow Soldering

Interaction Kinetics Between Pbga Solder Balls and Au/Ni/Cu Metallisation During Laser Reflow Bumping

Intermetallic Compounds Formation at Interface Between Pbga Solder Ball and Au/Ni/Cu/Bt Pcb Substrate after Laser Reflow Processes

Formation and change of AuSn4 compounds at interface between PBGA solder ball and Au/Ni/Cu metallization during laser and infra-red reflow soldering

The Effects of Laser Reflow Conditions on the Formation of Intermetallic Compounds at Sn3.0ag0.5cu Solder/Cu Joint Interface

Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Effect Of Laser Input Energy On Wetting Areas Of Solder And Formation Of Intermetallic Compounds At Sn-3.5ag-0.75cu/Au Right-Angled Joint Interface

Effects of Laser and Infrared Secondary Reflow on Microstructure of 63sn37pb/pad Interface

TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows

Interfacial Reactions Between Sn-Cu Solder Alloy and Cu/Ni Coatings During Reflow Soldering

Effect of Laser Input Energy on AuSnx Intermetallic Compounds Formation in Solder Joints with Different Thickness of Au Surface Finish on Pads

Cross-Interaction of Interfacial Reactions in Ni (Au/ni/cu)-Snag-cu Solder Joints During Reflow Soldering and Thermal Aging

Interfacial reaction between Sn-Ag-Cu solder and Co-P films with various microstructures

Sagging Phenomenon of Micro-Solder Joints Fabricated by Laser Reflow Process

The Evolution of Interfacial Microstructure of Sn3.5Ag Solder Bump with Cu Under-Bump Metallization