Directly Electroless-Plating NI-P Thin-Film to Fabricate Magnetic Core of Integrated Inductor for Printed Circuit Board

Guoyun Zhou,Xiaolan Xu,Ting Yang,Wei He,Shouxu Wang,Yuanming Chen,Wenjun Yang
DOI: https://doi.org/10.1109/cstic.2016.7463942
2016-01-01
Abstract:Integrated inductor with magnetic core is one of the three significant passive components for PCB (Printed Circuit Board) assembly. In this paper, a novel structure of integrated inductor with Ni-P (low P content) magnetic core deposited on the as-patterned conductive copper lines was fabricated by directly electroless-plating method. Two types of PCB integrated inductor with patterns of rectangle and hexagon winding were designed, respectively. The inductance changes were investigated under the changes of Ni-P plating times and tested frequency. Obvious increasing was observed after the deposition of Ni-P magnetic core. Furthermore, effects of the P content of Ni-P thin-film were also investigated in this paper.
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