Mechanical Properties and Thermal Stability of the High-Thermoelectric-Performance Cu 2 Se Compound
Jian Zhang,Cheng Zhang,Ting Zhu,Yonggao Yan,Xianli Su,Xinfeng Tang
DOI: https://doi.org/10.1021/acsami.1c12533
2021-09-14
Abstract:The Cu2Se compound possesses extraordinary thermoelectric performance at high temperatures and shows great potential for the application of waste heat recycling. However, a thermoelectric device usually undergoes mechanical vibration, mechanical and/or thermal cycling, and thermal shock in service. Therefore, mechanical properties are of equal importance as thermoelectric performance. However, the mechanical performance and stability of the Cu2Se compound during long-term service at high temperatures have rarely been reported. In this study, we systematically investigated the mechanical properties of Cu2Se compounds synthesized by three varied methods (melting (M), self-propagating high-temperature synthesis (SHS), and a combination of SHS and ultrasonic treatment (UT)) and investigated the thermal stability of the SHS-UT compound under different annealing temperatures. The SHS-UT process effectively refines the grain size from 19 μm for the melting sample to 5 μm for the SHS-UT sample. The high density of grain boundaries in the SHS-UT sample effectively dissipates the energy of crack propagation; thus, the mechanical properties are greatly improved. The compressive strength, bending strength, and Vickers hardness of the SHS-UT sample are 147 MPa, 52.6 MPa, and 0.46 GPa, respectively, which are 21.5, 16.6, and 35.3% higher than those of the melting sample, respectively. Moreover, excellent thermal stability is achieved in the compound prepared by SHS and ultrasonication at a temperature below 873 K. After annealing at temperatures up to 873 K for 7 days, the excellent thermoelectric performance of the Cu2Se compound is well maintained with a ZT value exceeding 1.80 at 873 K. However, with further increasing the annealing temperature to 973 K, the volatilization of Se and the precipitation of Cu result in the instability and significantly deteriorated thermoelectric performance of the material. This work provides an avenue for boosting the mechanical properties and commercial application of Cu2Se.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.1c12533.Experimental section (synthesis process, characterization of structure and composition, and measurement of mechanical properties and thermoelectric transport properties); compressive strength–displacement curves, flexural strength–displacement curves, and fracture strength–displacement curves for all samples; FESEM images of fracture structures for all samples; cycling tests for SHS-UT Cu2Se bulk; X-ray diffraction patterns of the SHS-UT Cu2Se sample before and after the annealing process; and density, relative density, and averaged atomic ratio for SHS-UT Cu2Se bulks before and after the annealing process (PDF)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology