The Synthesis and Investigation of Thermoelectric Properties of Cu4SnS4 at Elevated Temperatures

Bui Duc Long,Le Thi Bang,Tran Bao Trung,Pham Thanh Tuan Anh,Phan Bach Thang
DOI: https://doi.org/10.1007/s11665-024-09519-y
IF: 2.3
2024-05-09
Journal of Materials Engineering and Performance
Abstract:Cu 4 SnS 4 is a promising thermoelectric (TE) material due to its low thermal conductivity ( ) and relatively high electrical conductivity ( ) and Seebeck coefficient ( S ). In this research, Cu 4 SnS 4 was synthesized from Cu, Sn, and S powders using the mechanical alloying (MA) method. The 16-h milled powders were heat-treated and consolidated by spark plasma sintering at 873 K. TE properties of the 16-h milled sintered sample was investigated at elevated temperatures. It was observed that the formation of Cu 3 SnS 4 began after 8 h and completed after 16 h of milling, whereby the resulting material exhibited fine particle sizes, ranging from 0.2 to 1.3 μm. Cu 4 SnS 4 was formed after the heat treatment of the 16-h milled powder at 673 K, with a thermal stability up to 923 K. The band gap of the heat-treated powder was 1.62 eV. The values of power factor and the dimensionless figure of merit ( ZT ) increased dramatically with increasing temperature, until the maximum values of 174.4 μW/m K 2 and 0.05, respectively, were achieved at 723 K.
materials science, multidisciplinary
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