Abstract:Modern real-time systems utilize considerable amounts of power while executing computation-intensive tasks. The execution of these tasks leads to significant power dissipation and heating of the device. It therefore results in severe thermal issues like temperature escalation, high thermal gradients, and excessive hot spot formation, which may result in degrading chip performance, accelerating device aging, and premature failure. Thermal-Aware Scheduling (TAS) enables optimization of thermal dissipation to maintain a safe thermal state. In this work, we implement a new TAS algorithm, POD-TAS, which manages the thermal behavior of a multi-core CPU based on a defined set of states and their transitions. We compare the performances of a dynamic RC thermal circuit simulator (HotSpot) and a reduced order Proper Orthogonal Decomposition (POD)-based thermal model and we select the latter for use in our POD-TAS algorithm. We implement a novel simulation-based evaluation methodology to compare TAS algorithms. This methodology is used to evaluate the performance of the proposed POD-TAS algorithm. Additionally, we compare the performance of a state of the art TAS algorithm, RT-TAS, to our proposed POD-TAS algorithm. Furthermore, we utilize the COMBS benchmark suite to provide CPU workloads for task scheduling. Our experimental results on a multi-core processor using a set of 4 benchmarks demonstrate that the proposed POD-TAS method can improve thermal performance by decreasing the peak thermal variance by 53.0% and the peak chip temperature of 29.01%. Using a set of 8 benchmarks, the comparison of the two algorithms shows a decrease of 29.57% in the peak spatial variance of the chip temperature and 26.26% in the peak chip temperature. We also identify several potential future research directions.

Thermal-aware SoC Test Scheduling with Voltage/Frequency Scaling and Test Partition

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Rapid Generation of Thermal-Safe Test Schedules

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

System-Level Analysis of 3D ICs with Thermal TSVs

Scheduling Tests for 3D Stacked Chips under Power Constraints

Thermal-Aware Small-Delay Defect Testing in Integrated Circuits for Mitigating Overkill

Regulating CPU Temperature With Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model

Thermal-Aware Feedback Control Scheduling for Soft Real-time Systems

Improving TAS Adaptability with a Variable Temperature Threshold

Thermal-Aware Task Scheduling for 3D Multicore Processors.

Temperature-aware Task Scheduling Heuristics on Network-on-Chips

Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

Thermal-aware Cell and Through-Silicon-via Co-Placement for 3D ICs.

A New Thermal-Conscious System-Level Methodology for Energy-Efficient Processor Voltage Selection

Thermal-Aware Incremental Floorplanning for 3D ICs Based on MILP Formulation.

An SMDP-based approach to thermal-aware task scheduling in NoC-based MPSoC platforms

Thermal-aware small-delay defect testing in integrated circuits