Wafer-Scale Flexible Surface Acoustic Wave Devices Based on an Aln/Si Structure

Zhang Cang-Hai,Yang Yi,Zhou Chang-Jian,Shu Yi,Tian He,Wang Zhe,Xue Qing-Tang,Ren Tian-Ling
DOI: https://doi.org/10.1088/0256-307x/30/7/077701
2013-01-01
Chinese Physics Letters
Abstract:Wafer-scale flexible surface acoustic wave (SAW) devices based on AlN/silicon structure are demonstrated. The final fabricated devices with a 50 mu m-thickness silicon wafer exhibit good flexibility with a bending curvature radius of 8 mm. Measurements under free and bending conditions are carried out, showing that the central frequency shifts little as the curvature changes. SAW devices with central frequency about 191.9 MHz and Q-factor up to 600 are obtained. The flexible technology proposed is directly applied to the wafer silicon substrate in the last step, providing the potential of high performance flexible wafer-scale devices by direct integration with mature CMOS and MEMS technology.
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