Above-IC Generic Poly-Sige Thin Film Wafer Level Packaging and MEM Device Technology: Application to Accelerometers
B. Guo,L. Wen,P. Helin,G. Claes,A. Verbist,R. Van Hoof,B. Du Bois,J. De Coster,I. De Wolf,A. Hadi Shahar,Y. Li,H. Cui,M. Lux,G. Vereecke,H. A. C. Tilmans,L. Haspeslagh,S. Decoutere,H. Osman,R. Puers,S. Severi,A. Witvrouw
DOI: https://doi.org/10.1109/memsys.2011.5734434
2011-01-01
Abstract:We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical) platform technology for integrating various packaged MEM devices above standard CMOS. The packages, having cavities as large as 1mm2, make use of pillars designed to withstand subsequent molding during 1st level packaging. Covers on top of the release holes avoid deposition inside the cavity during sealing. Hermeticity is proven in vacuum, air and N2 atmosphere and at different temperatures. Packaged functional accelerometers sealed at a pressure around 1bar, have an equivalent performance in measuring accelerations of about 1g compared to a piezoelectric commercial reference device.