Liquid Injection Atomic Layer Deposition of Crystalline TiO[sub 2] Thin Films with a Smooth Morphology from Ti(O-i-Pr)[sub 2](dpm)[sub 2]

Seong Keun Kim,Susanne Hoffmann-Eifert,Shaobo Mi,Rainer Waser
DOI: https://doi.org/10.1149/1.3138722
IF: 3.9
2009-01-01
Journal of The Electrochemical Society
Abstract:TiO2 thin films were grown at susceptor temperatures from 340 to 470 degrees C by liquid injection atomic layer deposition (ALD) using Ti(O-i-Pr)(2)(DPM)(2) [Ti(OC3H7)(2)(C11H19O2)(2), titanium dipivaloylmethanato di-isopropoxide] dissolved in ethylcyclohexane as a Ti source and H2O as an oxidant. The self-saturation growth behavior of the TiO2 films was confirmed up to 390 degrees C. Within the ALD window, the growth rate of the films increased from 0.022 nm/cycle at 340 degrees C to 0.046 nm/cycle at 390 degrees C, and the films exhibited a carbon content below 3 atom %. Due to the thermal decomposition of the precursor at 470 degrees C, the growth rate of the films largely increased and the film density decreased by the increase in the carbon content of the film. The films showed quite a smooth surface morphology over the whole range of growth temperatures. The increase in the film thickness did not significantly change the surface morphology of the films due to the formation of the crystalline phase even at an initial growth stage. The relative permittivity of the TiO2 films, which were crystallized into an anatase structure, was approximately 35-40. The films grown within the ALD window showed reasonable leakage current properties.
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