A Metrology Of Silicon Film Thermal Conductivity Using Micro-Raman Spectroscopy

xi liu,xiaoming wu,tianling ren
DOI: https://doi.org/10.1109/SOI.2010.5641397
2010-01-01
Abstract:We present a steady state technique enhanced with micro-Raman spectroscopy to measure thermal conductivity of SOI silicon device layer. This metrology, comparing to conventional technique based on thermistor, exhibits two improvements: robustness against ambient disturbance, which leads to an error of 28%, and reduction on measurement system error from 20% to 10%.
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