Abstract:Owing to high heat flux ability and good mechanical strength, copper has been used for micro-electro-mechanical systems (MEMS) components with dimensions in micrometers processed by electrochemical methods. In the present study, fine grained copper foils of different thicknesses and grain sizes produced by pulsed electrodeposition under different controlled current densities were used to investigate the effect of total number of grains across thickness of foil on its tensile response and formability. For a comparative study, commercially available rolled Cu foils were also used. Vacuum annealing was employed to obtain a wide range of fully recrystallized grain sizes within same thickness of the foils. Detailed microstructural characterization was carried out using scanning electron microscope attached with electron backscattered diffraction detector. The foils were subjected to uniaxial tensile testing and formability testing using a miniaturized Nakazima test setup. As anticipated, finer the grain size higher was the yield strength. However, the strength of copper reduced with decreasing the total number of grains across thickness of the foil. The electrodeposited Cu foil exhibited relatively higher strength levels but reduced tensile ductility along with decreased strain hardening ability compared to the fully recrystallized Cu foils having similar grain sizes. Furthermore, the number of grains across thickness and the prior history of foils played significant role on the shape and trend in variation of the forming limit curve of Cu. An α-fiber (< 110 >) texture evolved in Cu during deformation and its volume fraction strengthened under biaxial deformation conditions.Graphical

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