Temporary Bonding/debonding Based on Propylene Carbonate

Zhiyuan Zhu,Hong Du,Yong Guan,Hao Wang,Min Yu,Yufeng Jin,Zhao Zhang
DOI: https://doi.org/10.1109/icept.2015.7236565
2015-01-01
Abstract:This paper carried out extensive research about temporary bonding/debonding schemes based on propylene carbonate (PPC). The temporary bonding was investigated at different bonding temperatures and bonding time. The bonding pressure is 0.2 MPa. The highest shear strength of 4.1 MPa is achieved at bonding temperature of 150°C and bonding time of 20 min. The bonded wafers were debonded using thermal and chemical method.
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