Experimental Study of Chip Offset on the Packaging Consistency of High Power Light-Emitting Diodes

Bin Xie,Qi Chen,Xingjian Yu,Bofeng Shang,Mengyu Huang,Xiaobing Luo
DOI: https://doi.org/10.1109/icept.2015.7236763
2015-01-01
Abstract:In this study, we experimentally investigated the effect of chip offset on the packaging consistency of high power LED. A series of LED modules with different chip offset distances and phosphor mass concentration were packaged, and two comparative experiments were conducted. Compared with the conventional modules, the maximum CCT deviation of off-centered modules increased from 128K to 667K. The results show that chip offset contributes significantly to the consistency of LED packaging.
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