Far-Field Pattern Simulation of Flip-Chip Bonded Power Light-Emitting Diodes by A Monte Carlo Photon-Tracing Method

F Hu,KY Qian,Y Luo
DOI: https://doi.org/10.1364/ao.44.002768
IF: 1.9
2005-01-01
Applied Optics
Abstract:The far-field pattern of light-emitting diodes (LEDs) is an important issue in practical applications. We used a Monte Carlo photon-tracing method for the package design of flip-chip bonded power LEDs. As a first-order approximation, we propose using a plane light source model to calculate the far-field pattern of encapsulated LEDs. The far-field pattern is also studied by use of a more detailed model, which takes the structure of all epitaxial layers of a flip-chip bonded power LED into consideration. By comparing the simulation results with the experimental data, we have concluded that the plane light source model is much less time-consuming and offers fairly good precision for package design.
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