Abstract:According to the requirements on minimizing the package size, guaranteeing the performance uniformity and improving the manufacturing efficiency in LEDs, a Chip Scale Packaging (CSP) technology has been developed to produce white LED chips by impressing a thin phosphor film on LED blue chips. In this paper, we prepared two types of phosphor-converted white LED CSPs with high color rendering index $(\mathbf{CRI} > 80, \mathbf{CCT}\sim 3000$ K and 5000K) by using two mixed multicolor phosphor materials. Then, a series of testing and simulations were conducted to characterize both short- and long-term performance of prepared samples. A thermal analysis through both IR thermometry and electrical measurements and thermal simulation were conducted first to evaluate chip-on-board heat dissipation performance. Next, the luminescence mechanism of multicolor phosphor mixtures was studied with the spectral power distribution (SPD) simulation and near-field optical measurement. Finally, the extracted features of SPDs and electrical current-output power (I-P) curves measured before and after a long-term high temperature accelerated aging test were applied to analyze the degradation failure mechanisms. The results of this study show that: 1) The thermal management for prepared CSP samples provides a safe usage condition for packaging materials at ambient temperature; 2) The Mie theory with ray-tracing simulation can be used to simulate the SPD of Pc-white LEDs with mixed multicolor phosphors; 3) The degradation failure mechanisms of Pc-white LEDs can be determined by analyzing the extracted features of SPDs collected after aging.

Simulation of Phosphor Converted LED Packaging with Considerations on Phosphor Settling

Effect of phosphor settling on the optical performance of phosphor-converted white light-emitting diode

Precise model of phosphor geometry formed in dispensing process of LED packaging

Dynamic Phosphor Sedimentation Effect on the Optical Performance of White LEDs

Numerical Research of High Viscosity Phosphor Flow Field Distribution of High-Power LED Phosphor Coating Process

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Studies on Optical Consistency of White LEDs Affected by Phosphor Thickness and Concentration Using Optical Simulation

Study on Phosphor Sedimentation Effect in White Light-Emitting Diode Packages by Modeling Multi-Layer Phosphors with the Modified Kubelka-Munk Theory

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation

Modeling on Phosphor Sedimentation Phenomenon During Curing Process of High Power LED Packaging

Effects of Packaging Structure on Optical Performances of Phosphor Converted Light Emitting Diodes

Optical Analysis of Color Distribution in White Leds with Various Packaging Methods

Development of Optical-Thermal Coupled Model for Phosphor-Converted LEDs

Phosphor Modeling Based on Fluorescent Radiative Transfer Equation.

Far-Field Pattern Simulation of Flip-Chip Bonded Power Light-Emitting Diodes by A Monte Carlo Photon-Tracing Method

Effects of Phosphor’s Location on LED Packaging Performance

Experimental and Numerical Study of Phosphor Dispensing Process in Light Emitting Diodes

Inhibition of phosphor sedimentation for white light-emitting diodes with a facilely realizable and economical method

Investigation on dip-transfer phosphor coating for light-emitting diodes: Experiments and VOF simulations

Numerical and Experimental Study on the Transferred Volume in Phosphor Dip-Transfer Coating Process of Light-Emitting Diodes Packaging

Optical Analysis of Phosphor's Location for High-Power Light-Emitting Diodes