Abstract:As a core packaging material of light color conversion, phosphor/silicone composite plays an indispensable role in light emitting diode (LED) packaging. At present, commercial LED packages mainly use blue LED chips to stimulate Yttrium Aluminum Garnet (YAG) yellow phosphor to reach a white color. However, (Ca,Sr)AlSiN <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</inf> :Eu <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2+</sup> (CSASN) red phosphor is often added to improve the color-rendering performance given the absence of red light emission spectrum. However, inevitably harsh working conditions can induce the degradation of CSASN red phosphor, which will directly influence the mechanical properties of its silicone composites and challenge the reliability of its LED packaging. In this study, the coupling effects of temperature–humidity–sulfur on the mechanical degradation of CSASN phosphor/silicone composites were considered. The prepared CSASN phosphor/silicone test samples were first aged under high-temperature, high-humidity, and high-sulfur conditions. A series of dynamic mechanical analysis tests were then conducted to qualitatively evaluate their mechanical properties. Finally, the dynamic tension process and interfacial cracking of CSASN phosphor/silicone composites were simulated by using finite element analysis with cohesive modeling. The results showed that: (1) under coupled aging conditions, the mechanical properties of the phosphor/silicone composite decreased due to the reaction of phosphor with sulfur, water, and oxygen; (2) crack initiation and propagation were most likely to occur at the edge of the crack perpendicular to the tensile direction. The debonding of particles with silicone rather than the fracture of phosphors was one of the main aspects resulting in failure mechanisms; (3) the highly concentrated and localized phosphor in the silicone matrix and the irregular shape and arrangement of phosphor particles generated cracks in the phosphor/silicone composite.

Modeling on Phosphor Sedimentation Phenomenon During Curing Process of High Power LED Packaging

Phosphor self-heating in phosphor converted light emitting diode packaging

Precise model of phosphor geometry formed in dispensing process of LED packaging

Investigation of Mechanical Properties of Silicone/Phosphor Composite Used in Light Emitting Diodes Package

High Moisture Accelerated Mechanical Behavior Degradation of Phosphor/Silicone Composites Used in White Light-Emitting Diodes

Inhibition of phosphor sedimentation for white light-emitting diodes with a facilely realizable and economical method

Effect of phosphor settling on the optical performance of phosphor-converted white light-emitting diode

Effect Study of Silicone Amount on the Lumen Maintenance of High Power Led under Accelerated Stress Test

Simulation-Based Optimization of Cure Cycle of Large Area Compression Molding for LED Silicone Lens

Coupling effects of thermal-humidity-sulfur aging on mechanical properties of (Ca,Sr)AlSiN3:Eu2+ phosphor/silicone composites with experimental and numerical interpretation

Sulfur-Rich Ageing Mechanism of Silicone Encapsulant Used in LED Packaging: An Experimental and Molecular Dynamic Simulation Study

Thermal Model of Phosphor Self-Heating in Phosphor-Converted Light-Emitting Diodes

Simulation of Phosphor Converted LED Packaging with Considerations on Phosphor Settling

Dynamic mechanical analysis of (Ca,Sr)AlSiN<inf>3</inf>:Eu<sup>2+</sup> phosphor/silicone composites aged under the temperature–humidity–sulfur coupled condition

Research on Failure Mechanism of the Phosphors and Sealants for White Light Emitting Diode Package

Effect of the Substrate Temperature on the Phosphor Sedimentation of Phosphor-Converted LEDs

Study on Phosphor Sedimentation Effect in White Light-Emitting Diode Packages by Modeling Multi-Layer Phosphors with the Modified Kubelka-Munk Theory

Effect of the amount of phosphor silicone gel on optical property of white light-emitting diodes packaging

Spreading Behaviors Of Silicone Droplet Impact On Flat Solid Surface: Experiments And Vof Simulations

Dynamic Phosphor Sedimentation Effect on the Optical Performance of White LEDs

Thermal, optical and electrical analysis on phosphor-converted white LED Chip Scale Packages with both experiment and simulation