Optimization of Heat Sink Design Based on Chimney Effect for Integrated Packaging Semiconductor Lighting Source

张国旺,韩彦军,罗毅,李洪涛
DOI: https://doi.org/10.16818/j.issn1001-5868.2013.05.003
2013-01-01
Abstract:For semiconductor lighting source based on integrated packaging light-emitting diode (COB LED), the effects of shape, size and distribution of air conducting holes on the heat dissipation characteristics of chimney effect based heat sink are studied. It is indicated by CFD simulations that, for the heat dissipation structure of COB LED of 50 W thermal power, by forming two rectangular air conducting holes of 15 cm2 symmetrically to the center of lighting source on the thermally conducting plate, the weight of the chimney effect based heat sink is further reduced by 15% while keeping the temperature of COB LED below 52°C. Experimental results and simulation results are basically consistent.
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