Simulation Analysis of Point Defects in Silicon Ingot During Unidirectional Solidification Process for Solar Cells

Xuejiang Chen,Satoshi Nakano,Lijun Liu,Koichi Kakimoto
DOI: https://doi.org/10.1149/1.3096568
2009-01-01
ECS Transactions
Abstract:A transient global model was used to obtain the solution of thermal field within the entire furnace of a unidirectional solidification process. The melt-solid interface shape was obtained with a dynamic interface tracking method. And then, based on the global solution of heat transfer, influence of growth rate Vg, temperature gradient G and ratio Vg/G on point defects were analyzed. Finally, several different melt-solid interface shapes were obtained by using different solidification times. Then, the effects of solidification times on ratio Vg/G and point defects were also studied.
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