3D Numerical Analysis of the Influence of Material Property of A Crucible on Stress and Dislocation in Multicrystalline Silicon for Solar Cells

X. J. Chen,S. Nakano,K. Kakimoto
DOI: https://doi.org/10.1016/j.jcrysgro.2010.10.067
IF: 1.8
2011-01-01
Journal of Crystal Growth
Abstract:We carried out calculations to investigate the influence of thermal conductivity of the wall of a crucible on thermal stress and dislocations in a silicon ingot during a solidification process using a three-dimensional global analysis. It was found that the m–c interface shape and the temperature gradient in a silicon ingot have significant influence on thermal stress and dislocations due to different thermal conductivity of the wall of a crucible. Therefore, we should control not only the m–c interface shape, but also temperature gradient in a silicon ingot in order to reduce thermal stress and dislocations in a silicon ingot during a solidification process.
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